Dual Beam Slice and View 3D Reconstruction Curtaining Correction
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Solution Overview
Problem
The Slice-and-View technique in electron microscopy faces challenges in achieving high-resolution 3D representations due to topographical variations caused by the 'curtaining' effect, which assumes flat surfaces, leading to noise and decreased resolution in 3D reconstructions.
Innovation Solution
A method and apparatus that utilize a dual beam system to capture images of a sample's vertical wall from different orientations, calculating elevations and fitting curves to approximate the topography, thereby accounting for variations in surface morphology and improving resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If the focused ion beam is used to cut and slice the sample to reveal 3D internal structures, then the ability to observe hidden features is improved, but topographical variations and curtaining artifacts are introduced that degrade image quality
Solution Approach 1:
A digital elevation model (DEM) is introduced as an intermediary data structure that captures topographical information from multiple images. This DEM serves as a mediator that separates the cutting process from the imaging process, allowing the system to account for surface variations without letting them degrade the final 3D reconstruction quality
Solution Approach 2:
The system changes the viewing angle parameter by capturing images at multiple different angles. This allows the acquisition of topographical information that can be used to correct for curtaining artifacts and improve the accuracy of the 3D representation
2Loss of information
If sequential slicing and imaging is performed to reconstruct 3D structures, then the ability to visualize internal features is improved, but noise and decreased resolution occur due to surface non-flatness
Solution Approach 1:
The system uses feedback by comparing images captured at different angles and using the discrepancies to update the digital elevation model. This feedback loop allows the system to iteratively improve the topographical accuracy, which in turn improves the resolution of the final 3D representation
Solution Approach 2:
The system transitions from 2D image data to 3D topographical information by capturing images at multiple angles and constructing a digital elevation model. This addition of the vertical dimension (elevation) allows for accurate compensation of surface variations in the final 3D reconstruction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the resolution of 3D representations by accurately characterizing and correcting for topographical variations, reducing noise and improving the accuracy of 3D reconstructions in electron microscopy.
Implementation Method 1
exposing surfaces of the sample by removing slices of the sample with an etching beam
Implementation Method 2
capturing images of the surfaces exposed by the etching beam
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
Methods, apparatuses, and systems for slice and view processing of samples with dual beam systems. The slice and view processing includes exposing a vertical wall of a trench formed in a sample surface; capturing a first image of the wall by interrogating the wall with an interrogating beam while the wall is at a first orientation relative to the beam; capturing a second image of the wall by interrogating the wall with the beam while the wall is at a second orientation relative to the beam, wherein first distances in the first image between a reference point and surface points on the wall are different than second distances in the second image between the reference point and the surface points; determining elevations of the surface points using the first distances and the second distances; and fitting a curve to topography of the wall using the elevations.