Dual-Binding Pad Array Substrate for Damaged Pad Recovery
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Solution Overview
Problem
Existing methods for preparing a light-emitting substrate and a preparation method thereof, and an array substrate, in particular, for addressing the preparation of Micro LED and Mini LED light-emitting substrates fail to prevent damage to binding pads, leading to the discarding of entire array substrates.
Innovation Solution
A polygonal array substrate with symmetrically distributed binding pads and metal wiring layers, allowing for flexible connection with driving circuit boards and enabling rotation to replace damaged pads without discarding the substrate, and a method of forming and splicing these substrates to form larger light-emitting substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness or width of the driving lead is increased to reduce resistance, then the voltage drop on the driving lead is reduced, but the complexity of the substrate structure increases
Solution Approach 1:
The substrate is divided into multiple array substrates with binding pads distributed at different locations (first binding area near first lateral side, second binding area near second lateral side). This segmentation allows the driving circuit board to connect at multiple points, effectively distributing the current load and reducing voltage drop without requiring excessively thick or wide single driving leads.
Solution Approach 2:
Instead of increasing the cross-sectional dimensions (thickness/width) of driving leads in one dimension, the solution transitions to utilizing multiple binding areas positioned at different locations on the substrate. This dimensional redistribution allows multiple connection points to share the electrical load, achieving voltage drop reduction through spatial distribution rather than dimensional enlargement.
2Manufacturing precision
If binding pads are damaged during the preparation process, then the entire array substrate must be discarded, but this leads to loss of manufacturing resources and reduced productivity
Solution Approach 1:
Different binding areas (first binding area with first binding pads, second binding area with second binding pads) are positioned at different locations on the substrate. This local quality distribution ensures that damage to binding pads in one area does not necessarily compromise the entire substrate, as other binding areas remain functional and can be used for connection.
Solution Approach 2:
The substrate is designed with redundant binding areas that can serve as backup connections. If binding pads in one area are damaged, the substrate can still be recovered and used by connecting through the remaining intact binding pads in other areas, thereby preventing complete substrate discard and improving overall yield.
3Adaptability or versatility
If multiple binding areas are provided on the substrate, then the substrate can be flexibly connected and reused even if some pads are damaged, but the device complexity increases
Solution Approach 1:
The substrate design incorporates asymmetric distribution of binding areas relative to different lateral sides. The first binding area is positioned near the first lateral side while the second binding area is positioned near the second lateral side. This asymmetric yet balanced layout provides connection flexibility without requiring fully symmetric complex structures, achieving adaptability with moderate structural complexity.
Data Source
AI summary
This disclosure relates to a light-emitting substrate, a preparation method thereof, and an array substrate, and relates to the technical field of display. The array substrate is polygonal and has at least one set of first and second lateral sides oppositely arranged, and has a first binding area arranged near the first lateral side and a second binding area arranged near the second lateral side. The array substrate includes a base substrate and a pad layer arranged on a main surface of the base substrate. The pad layer includes first binding pads in the first binding area, and second binding pads in the second binding area. Any one of the first binding area and the second binding area is configured to connect with a driving circuit board to drive the array substrate. The array substrate can avoid the binding pad from being damaged and thus discarding the array substrate.