Dual-Blade Wire Bond Capillary for Clean Wire Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing ball bonding capillaries face challenges in reliably forming electrical connections between small bond pads on semiconductor dies and external electrical connections, particularly with harder materials like copper or copper-palladium alloys, which are prone to lifted wire defects.
Innovation Solution
The capillary design incorporates a dual-blade structure at its lower tip, with a first blade for cutting and a second blade for weakening the bond wire, enhancing the reliability of the ball bonding process and reducing lifted wire defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single-blade capillary design is used, then the device complexity is low, but the reliability of ball bonding is insufficient due to lifted wire defects
Solution Approach 1:
The capillary blade is segmented into two distinct blades: a first blade for cutting the bond wire and a second blade for weakening the bond wire. This segmentation allows each blade to perform its specific function optimally, improving ball bonding reliability by preventing lifted wire defects while maintaining a relatively simple overall capillary structure.
2Reliability
If the bond wire is not weakened before cutting, then the cutting process is simpler, but lifted wire defects occur due to incomplete separation
Solution Approach 1:
The second blade performs a preliminary action by weakening the bond wire at a specific location before the first blade completes the cut. This preliminary weakening ensures that the wire separates cleanly and reliably at the intended location, preventing lifted wire defects. The dual-blade design integrates this preliminary action into the bonding process without significantly reducing productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual-blade capillary design significantly improves the reliability of ball bonding by ensuring clean cuts and controlled wire separation, effectively addressing the issue of lifted wire defects and enhancing the overall efficiency of the bonding process.
Implementation Method 1
at least partially cutting the bond wire at a first location in the second portion with the first blade
Implementation Method 2
weakening the bond wire at a second location in the second portion with the second blade
Implementation Method 3
applying sufficient tension to additional bond wire disposed in the lumen of the capillary and connected to the second portion of the bond wire to cause the bond wire to break at one of the first location or the second location
Implementation Method 4
bonding a first portion of the bond wire to the bond pad of the semiconductor die with a capillary... bonding the first portion of the bond wire to the bond pad of the semiconductor die includes melting an end of the bond wire by applying electrical energy to the end of the bond wire
Implementation Method 5
applying one or more of heat, pressure, or ultrasonic energy to the first portion of the bond wire while the bond wire is in contact with the bond pad
Implementation Method 6
applying one or more of heat, pressure, or ultrasonic energy to the first portion of the bond wire while the bond wire is in contact with the bond pad
Data Source
AI summary
A capillary for performing ball bonding includes a body defining a lumen, a first blade defined in a lower tip of the body, and a second blade defined in the lower tip of the body for increasing reliability of a ball bonding procedure performed using the capillary.