Dual-Board Case for Multi-Mainboard Heat Dissipation
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Solution Overview
Problem
High-performance computing (HPC) systems with blade architectures face challenges in heat dissipation efficiency due to narrow airflow passages, leading to increased noise and complexity, as well as limitations in increasing fan size or radiation fin length without expanding the overall case width.
Innovation Solution
A dual-board case design featuring a tubular housing with staggered mainboards and extended track systems allows for larger radiation fins and improved airflow passages, reducing noise and enhancing heat dissipation without increasing the case's overall width, utilizing a cover plate with fan vents and cooling fans for optimized airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple mainboards are parallelly arranged in a blade architecture, then high density and convenient management are achieved, but heat-dissipation efficiency deteriorates due to narrow airflow passages
Solution Approach 1:
The patent transitions from a traditional parallel blade architecture to a face-to-face mainboard arrangement with staggered processors. This dimensional reconfiguration creates wide, unobstructed airflow passages between the two mainboards, allowing air to flow smoothly from the front open end through the entire length of the tubular housing to the rear open end, significantly improving heat dissipation while maintaining high density
2Speed
If high-speed small fans are used to provide sufficient air pressure through narrow passages, then airflow through radiation fins is improved, but noise increases due to high rotary speed
Solution Approach 1:
The patent extracts and eliminates the narrow airflow passages that caused the need for high-speed fans. By reconfiguring the mainboard arrangement to create wide, open airflow passages, the system no longer requires high-speed small fans to generate sufficient air pressure, thereby eliminating the noise source while maintaining effective airflow through the radiation fins
3Temperature
If fan size or radiation fin length is increased to enhance heat dissipation, then heat-dissipation efficiency is improved, but the overall case width must be increased
Solution Approach 1:
The patent utilizes the longitudinal dimension of the tubular housing to accommodate larger radiation fins and fans. By arranging mainboards in a face-to-face configuration within the extended length of the housing, the design allows radiation fins to extend along the length of the housing and fans to be positioned at the open ends, enabling enhanced heat dissipation components without increasing the cross-sectional width of the case
4Productivity
If narrow spaced airflow passages are created in blade architecture, then high density is achieved, but turbulence increases causing louder whooshing sound
Solution Approach 1:
The patent eliminates narrow spaced airflow passages by reconfiguring the mainboard arrangement to create wide, open airflow channels. Air flows smoothly through the large unobstructed space between the two face-to-face mainboards from front to rear, preventing turbulence and the associated whooshing noise while maintaining high density through the compact tubular housing design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves enhanced heat-dissipation efficiency and reduced noise by creating a larger, unobstructed airflow passage between staggered mainboards, enabling the use of larger fans and extended radiation fins without increasing the case's size, while maintaining a compact form factor.
Implementation Method 1
The cover plate is provided with several fan vents. Cooling fans may be mounted on an interior of the cover plate corresponding to the fan vents to assist in good flowing of cooling airflow.
Implementation Method 2
a distance between the loading surface and a top of radiation fins attached to any processor on the mainboard mounted on that loading surface
Implementation Method 3
radiation fins attached to any processor
Data Source
AI summary
A dual-board case for multi-mainboard system includes a rectangular-sectioned tubular housing, in which two track sets are provided; and two mainboard trays being movably mounted on the two track sets to locate at an interior of two opposite lateral walls of the tubular housing. Each of the two mainboard trays has a loading surface, on which a mainboard is mounted; and the two mainboard trays are mounted on the track sets with their loading surfaces and accordingly, the two mainboards mounted thereon facing toward each other. Therefore, the dual-board case allows a multi-mainboard system to have optimal spatial arrangement to achieve best heat-dissipation efficiency and largely reduce noises.