Dual Bonding Head Sequencing to Prevent Stage Bending Shifts
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Solution Overview
Problem
Conventional semiconductor device manufacturing devices face challenges in maintaining positional accuracy of chips due to stage bending during pressurizing processes, which can lead to inaccurate horizontal positioning and relative position shifts between electrodes and chips.
Innovation Solution
The semiconductor device manufacturing device employs multiple independently movable bonding heads that execute positioning, grounding, and pressurizing processes in a coordinated manner, allowing these processes to overlap partially during non-pressurizing periods, ensuring accurate positioning and grounding before applying bonding loads, and utilizing a controller to stagger and synchronize the execution of these processes to minimize stage bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple bonding heads execute positioning and grounding processes while other bonding heads are executing pressurizing processes, then bonding efficiency is improved, but positional accuracy of the chip deteriorates due to stage bending
Solution Approach 1:
The invention applies preliminary action by completing the positioning and grounding processes for all bonding heads before any pressurizing process begins. This ensures that the stage is not bent during positioning operations, maintaining positional accuracy. The controller coordinates the processes so that positioning and grounding are finished in advance, allowing subsequent pressurizing operations to proceed without affecting the already-positioned chips.
Solution Approach 2:
The invention implements dynamic process coordination where the controller dynamically adjusts the execution timing of positioning, grounding, and pressurizing processes for multiple bonding heads. The system transitions from static sequential processing to dynamic overlapping processing, allowing positioning and grounding to be completed before pressurizing starts, thereby maintaining precision while improving overall throughput.
2Productivity
If the pressurizing process is executed by multiple bonding heads simultaneously, then productivity is improved, but the stage bending increases causing positional shifts
Solution Approach 1:
The invention applies preliminary action by ensuring all positioning and grounding operations are completed before any pressurizing process begins. This preliminary completion of positioning tasks ensures that when multiple pressurizing operations occur simultaneously or in overlap, the stage bending does not affect the already-established horizontal positions of the chips.
Solution Approach 2:
The invention segments the bonding process into distinct phases: a positioning and grounding phase followed by a pressurizing phase. By separating these phases in time, the system allows positioning to occur on an undistorted stage, then enables multiple pressurizing operations that can overlap or occur simultaneously without compromising the positional accuracy established in the first phase.
Data Source
AI summary
A semiconductor device manufacturing device comprises: a stage; two bonding heads which are mutually independently horizontally movable; and a controller for causing each of the two bonding heads to perform a positioning process for horizontal positioning, a grounding process for lowering the chip until the chip is grounded on a substrate, and a pressurizing process for applying a bonding load to the chip that is grounded. The controller causes the two bonding heads to perform the positioning process and the grounding process independently from each other in a non-pressurizing period in which neither of the bonding heads is performing the pressurizing process, and causes the two bonding heads after completing the positioning process and the grounding process to perform the pressurizing process in parallel.