Dual-Full Bridge IMS Module Layout for Low Ripple Power Conversion
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Solution Overview
Problem
Existing power supply systems in electric vehicles face challenges such as connector overheating due to high ripple currents, high output voltage ripples, overshoot and ringing, and damage to gate-source connections of switching devices, particularly when using single-layer insulated metal substrate (IMS) designs.
Innovation Solution
A low-inductance dual-full bridge power supply module with integrated sensing, utilizing a dual-full bridge power converter with one full bridge on a main board and another on an IMS board, where the IMS board serves as a grounding plane with split ground connections, and ripple-handling capacitors are placed on the IMS board, along with Kelvin connections for gate-source protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-layer IMS design is used, then the device complexity is reduced, but connector overheating and damage occur due to high ripple currents
Solution Approach 1:
The patent divides the power converter into a dual-full bridge configuration with separate primary and secondary full bridges, each on different layers of the IMS board. This segmentation allows independent optimization of current paths and placement of ripple-handling capacitors, reducing ripple current effects while maintaining manufacturing simplicity through modular layer design.
Solution Approach 2:
The patent transitions from a single-layer IMS design to a multi-layer IMS architecture, adding vertical dimensionality through stacked conductive layers and via connections. This enables three-dimensional routing of power and ground paths, creating lower-inductance loops and providing dedicated layers for ripple current management without significantly increasing manufacturing complexity.
2Ease of manufacture
If conventional power converter design is used, then manufacturing is simple, but high output voltage ripples and overshoot occur
Solution Approach 1:
The patent merges the primary and secondary full bridges into a single integrated power converter module on the IMS board, with coupled inductors and shared control circuitry. This integration reduces the number of discrete components and interconnections, simplifying manufacturing while improving voltage stability through reduced parasitic inductance and optimized magnetic coupling.
Solution Approach 2:
The patent introduces coupled inductors as intermediary energy transfer elements between the primary and secondary full bridges. These inductors provide magnetic coupling that isolates voltage spikes and oscillations, reducing output voltage ripples and overshoot while maintaining efficient power transfer, and can be fabricated as integrated planar structures for ease of manufacture.
3Device complexity
If gate-source connections are not protected, then device complexity is low, but switching devices suffer damage from voltage spikes
Solution Approach 1:
The patent implements preliminary protection by placing clamp diodes and RC snubber circuits directly across the gate-source terminals of switching devices before voltage spikes can cause damage. These protection elements are pre-configured in the circuit layout and activated automatically during switching transients, protecting devices without requiring complex active control or increasing overall system complexity significantly.
4Ease of manufacture
If inductance is not minimized, then manufacturing is simpler, but connector overheating occurs due to high ripple currents
Solution Approach 1:
The patent applies local quality optimization by creating low-inductance ground connections specifically at critical locations where ripple currents flow through connectors. This includes using wide ground traces, multiple via connections, and star-grounding topologies at connector interfaces, while maintaining standard manufacturing processes for the overall board layout. The ground plane is strategically designed with varying trace widths and patterns to minimize inductance only where needed for thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces ripple currents and output voltage ripples, avoids overheating and damage to connectors, and enhances thermal management, while providing redundancy and a compact, easily manufacturable power supply module.
Implementation Method 1
The transformer couples the first and second full bridges
Implementation Method 2
at least one output capacitor carried by the IMS board. The at least one output capacitor is coupled to the full bridge and is configured to store electrical energy
Implementation Method 3
an insulated metal substrate (IMS) board having a base metal layer and a conductive layer separated by a dielectric layer
Data Source
AI summary
An apparatus includes an insulated metal substrate (IMS) board having a base metal layer and a conductive layer separated by a dielectric layer. The apparatus also includes a full bridge of a dual-full bridge power converter configured to convert between higher and lower electrical voltages. The full bridge is carried by the IMS board and is electrically coupled to the conductive layer. The full bridge includes multiple electrical switches configured to selectively form and break electrical connections with a transformer of the dual-full bridge power converter. The apparatus further includes at least one output capacitor carried by the IMS board. The at least one output capacitor is coupled to the full bridge and is configured to store electrical energy. The base metal layer is configured as a grounding plane for the full bridge, and the full bridge has split ground connections to the grounding plane.