Dual-Brush Substrate Cleaning for Uniform Two-Sided Wafer Cleaning
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Solution Overview
Problem
Existing substrate cleaning processes struggle to uniformly remove foreign matters, particularly after chemical mechanical polishing, necessitating multi-stage cleaning methods.
Innovation Solution
A substrate processing apparatus featuring dual brushes with adjustable cleaning faces and rotary axes, along with a controller, ensures comprehensive cleaning by rotating in unison with the substrate to cover both faces effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single brush is used to clean the substrate, then the device complexity is reduced, but the cleaning uniformity across both faces of the substrate deteriorates
Solution Approach 1:
The cleaning system is segmented into two separate brushes: a first brush for cleaning the first face of the substrate and a second brush for cleaning the second face. Each brush is independently configured to contact and clean its respective substrate face, ensuring uniform cleaning across both surfaces while maintaining manageable device complexity through modular design
Solution Approach 2:
The cleaning approach transitions from a single-sided cleaning mechanism to a dual-sided cleaning system by introducing a second brush operating on the opposite face of the substrate. This dimensional expansion allows simultaneous cleaning of both substrate faces, achieving uniform cleaning coverage throughout the entire substrate structure
2Manufacturing precision
If the brush width is made smaller to match the substrate face width, then the cleaning precision is improved, but the cleaning coverage deteriorates
Solution Approach 1:
Each brush is designed with a width that exceeds the width of its corresponding substrate face, creating a local quality advantage where the brush extends beyond the substrate boundaries. This excess width ensures complete coverage of the substrate face while allowing the brush to maintain precise contact with the substrate surface during rotation, achieving both precision and comprehensive coverage
3Manufacturing precision
If multi-stage cleaning processes are used to remove foreign matters, then the cleaning thoroughness is improved, but the processing time increases
Solution Approach 1:
The dual brush system enables continuous cleaning action on both substrate faces simultaneously. As the substrate rotates, both brushes continuously contact and clean their respective faces in an uninterrupted manner, eliminating the need for multi-stage sequential cleaning processes and significantly reducing total processing time while maintaining thorough cleaning effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves uniform cleaning of both faces of the substrate, preventing damage and ensuring thorough removal of foreign matters, enhancing the efficiency of the cleaning process.
Implementation Method 1
a first brush that faces the first face, and is configured to clean the first face by coming into contact with the first face and rotating in a first direction
Implementation Method 2
a first brush including a first cleaning face configured to come into contact with an entirety of the first face... a width of the first cleaning face is greater than a width of the first face
Data Source
AI summary
A substrate processing apparatus may include: a substrate including a first face and a second face that are opposite to each other; a substrate driver configured to come into contact with a peripheral part of the substrate, and provide a driving force to the substrate to rotate the substrate; a first brush that faces the first face, and is configured to clean the first face by coming into contact with the first face and rotating in a first direction; a second brush that faces the second face, and is configured to clean the second face by coming into contact with the second face and rotating in the first direction; and a controller configured to control at least one from among the substrate driver, the first brush, and the second brush.