Dual Bump IO Layout for HVIO and MSIO Compatibility
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Solution Overview
Problem
Advanced integrated circuits face challenges in supporting high voltage input/output (HVIO) connections due to their lower voltage operating ranges, which limits their compatibility with older HVIO technologies.
Innovation Solution
The implementation of a dual bump design for multiple purpose input/output (IO) connections within integrated circuit devices, where a first bump supports medium speed input/output (MSIO) connections and a second bump supports HVIO connections, allowing for selective coupling via a multiplexer to form either MSIO, HVIO, or both connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If advanced integrated circuits use lower voltage levels for MSIO communication, then manufacturing precision and integration density are improved, but compatibility with high voltage input/output (HVIO) technology is lost
Solution Approach 1:
The package is divided into separate functional domains: an advanced-node integrated circuit for MSIO operations and a legacy-node integrated circuit for HVIO operations. Each circuit operates independently at its optimal voltage level, eliminating voltage compatibility issues while maintaining high integration density through advanced manufacturing processes.
Solution Approach 2:
A package substrate acts as an intermediary between the advanced-node and legacy-node integrated circuits. This substrate provides electrical interconnection and mechanical support, enabling the two circuits with different voltage requirements to coexist and communicate without direct voltage conflict.
2Device complexity
If a single bump is used for both MSIO and HVIO connections, then device complexity is reduced, but reliability decreases due to potential failure modes affecting both connection types
Solution Approach 1:
The connection structure is segmented into separate bumps: first bumps for MSIO connections and second bumps for HVIO connections. This physical separation ensures that failures in one connection type do not propagate to the other, enhancing overall system reliability while maintaining manageable complexity through modular organization.
Solution Approach 2:
Different bump structures and materials are used optimized for their specific functions: MSIO bumps are designed for high-speed signal integrity, while HVIO bumps are designed for high voltage tolerance. This local optimization of connection quality for each specific application improves reliability without requiring excessive complexity.
3Reliability
If separate packages are used for MSIO and HVIO circuits, then reliability is improved by isolating failure modes, but manufacturing productivity decreases
Solution Approach 1:
Multiple integrated circuits (advanced-node for MSIO and legacy-node for HVIO) are merged into a single package with a unified substrate. This consolidation allows both circuits to be manufactured and assembled together in one process flow, significantly improving manufacturing productivity compared to producing separate packages, while still maintaining failure mode isolation through the separate circuit domains.
Data Source
AI summary
Systems or methods of the present disclosure may provide a dual bump design to support both high voltage input/output (HVIO) connections and medium speed input/output (MSIO) connections. The present disclosure includes an MSIO lane that couples to a first bump that couples to MSIO pins, a second bump that couples to an HVIO circuit, and a ball grid array (BGA) ball. The present disclosure also includes a multiplexer that selectively couples the MSIO pins to the BGA ball or the HVIO circuit to the BGA ball based on user input. As such, the MSIO lane may provide MSIO connections, HVIO connections, or both.