Dual Card Socket Layout Using Flexible Circuit Boards

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Solution Overview

Problem

Existing card sockets for mounting two-layer card trays are large in size and occupy excessive space in electronic devices, leading to inefficiencies and high manufacturing costs due to complex mold requirements.

Innovation Solution

A card socket apparatus comprising a mainboard, mainboard upper cover, support, first, and second flexible circuit boards, where the first and second card sockets are integrated into flexible circuit boards, reducing thickness and space requirements, and allowing for adjustable card mounting spaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If traditional card sockets are used to mount two-layer card trays, then card mounting functionality is achieved, but the card socket occupies large space in the electronic device

Engineering Contradiction:
Improvecard socket spaceVSAvoidcard mounting functionality
Core Design Contradiction:
Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The card socket is divided into two separate flexible circuit boards, each containing one card socket. This segmentation allows each socket to be independently optimized for smaller size while maintaining the overall two-card mounting functionality. The first flexible circuit board and second flexible circuit board can be arranged in different spatial configurations to minimize total space occupation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses flexible circuit boards instead of traditional rigid card socket structures. The flexible nature of these circuit boards allows them to be made thinner and more compact, significantly reducing the volume occupied by the card socket assembly while maintaining structural integrity and electrical connection capabilities.

Inventive Principle:
Principle #30Flexible shells and thin films

2Ease of manufacture

If traditional card socket structures are used, then card mounting is achieved, but manufacturing complexity and costs increase due to mold requirements

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidsocket structure complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent changes the structural parameters of the card socket by adopting flexible circuit board technology. This parameter change transforms the manufacturing process from traditional mold-based rigid structure fabrication to flexible circuit board production, which simplifies manufacturing and reduces the need for complex molds while maintaining structural functionality.

Inventive Principle:
Principle #35Parameter changes

3Volume of moving object

If card sockets are made thinner using flexible circuit boards, then space is reduced, but electrical connection reliability must be maintained

Engineering Contradiction:
Improvecard socket thicknessVSAvoidelectrical connection stability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The flexible circuit boards are designed with appropriate thickness and structural reinforcement to maintain electrical connection reliability despite the reduced overall thickness. The flexible nature allows for controlled deformation while maintaining stable electrical contacts with the cards, ensuring reliable data and power transmission.

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentEP4231467B1Card socket apparatus and electronic device
Publication Date: 2025.12.31 VIVO MOBILE COMM CO LTD
  • EP4231467B1 patent drawingFigure 1~2
  • EP4231467B1 patent drawingFigure 3~4
  • EP4231467B1 patent drawingFigure 5~6

AI summary

This application discloses a card socket apparatus and an electronic device, and relates to the technical field of communication devices. The card socket apparatus includes a mainboard, a mainboard upper cover, a support, a first flexible circuit board, and a second flexible circuit board. The mainboard is provided with a first opening, and the mainboard upper cover and the support are separately fixed on two sides of the mainboard. The first flexible circuit board is arranged on the mainboard upper cover, the first flexible circuit board includes a first card socket and a first electrical connection portion, and the first electrical connection portion is electrically connected to the first card socket. The second flexible circuit board is arranged on the support, the second flexible circuit board includes a second card socket and a second electrical connection portion, and the second electrical connection portion is electrically connected to the second card socket. The first card socket and the second card socket are both arranged opposite to the first opening, and a card mounting space is formed between the first card socket and the second card socket. The first electrical connection portion is electrically connected to the mainboard, and the second electrical connection portion is electrically connected to the mainboard.