Dual-Chamber Chip Package Layout for Sensor Interference Isolation
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Solution Overview
Problem
Existing electronic devices face challenges in miniaturization and suffer from mutual interference, such as signal and thermal interference, when multiple sensors are integrated within a single package structure, which reduces sensing performance.
Innovation Solution
The electronic device design separates sensing and processing chips into different chambers, with the processing chip being air isolated from the sensing chip, using adhesives to clad and protect the chips, and incorporating metal plates for electromagnetic shielding to reduce interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple sensors are integrated within a same package structure, then the device size is reduced, but signal interference and thermal effects occur between chips
Solution Approach 1:
The package structure is segmented into multiple independent chambers (first chamber for sensing chip, second chamber for processing chip) separated by isolation walls. This spatial segmentation allows each chip to operate in its own isolated environment, preventing signal interference and thermal effects while maintaining a compact overall package size.
Solution Approach 2:
The processing chip is extracted from the sensing chip's environment and placed in a separate second chamber. The air isolation mechanism extracts the harmful thermal and signal effects from the sensing chip's operational environment, allowing the sensing chip to function without interference while still being integrated within the same package.
2Volume of moving object
If multiple sensors are integrated within a same package structure, then device miniaturization is achieved, but sensing performance is reduced
Solution Approach 1:
The package is divided into separate chambers that physically isolate the sensing chip from interfering elements. This segmentation maintains compact packaging while preserving sensing performance by ensuring the sensing chip operates in a controlled, interference-free environment.
Solution Approach 2:
Different regions of the package are assigned different functional qualities: the first chamber provides a sensing-optimized environment with appropriate air pressure and isolation, while the second chamber accommodates the processing chip. This local differentiation ensures each chip operates under optimal conditions, maintaining high sensing performance within a miniaturized package.
3Ease of manufacture
If chips with different functions are disposed within a same chamber, then manufacturing complexity is reduced, but mutual interference occurs
Solution Approach 1:
The manufacturing process is adapted to create segmented chambers within the package structure. Although this adds some manufacturing steps (forming isolation walls, creating separate chambers), it prevents mutual interference between chips, ensuring reliable device operation. The segmentation is integrated into the overall manufacturing flow to minimize complexity increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces interference between chips, enhancing the sensing performance of the electronic device by isolating thermal and signal disturbances, thereby improving structural reliability and interference resistance.
Implementation Method 1
The first adhesive is filled in the second chamber and at least clads the second processing chip
Implementation Method 2
the second processing chip is air isolated from the first chamber
Data Source
AI summary
Provided is an electronic device, which includes a first substrate, a package, a first sensing chip, a first processing chip, a second processing chip and a first adhesive. The package is disposed on a first surface of the first substrate and defines a first chamber with the first substrate. One of the first substrate and the package has a second chamber. The second chamber has a first opening end and a first bottom wall opposite to each other. The first opening end is facing a direction away from the first chamber. The first bottom wall is located between the first opening end and the first chamber. The first sensing chip is located in the first chamber, and electrically connected to the first processing chip. The second processing chip is disposed in the second chamber, and air isolated from the first chamber.