Dual-Chamber Pump Isolates Coolant from Electronics
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Solution Overview
Problem
Liquid cooling for electronic equipment faces challenges such as leakage, corrosion, and weight issues, making it unsuitable for applications with lower power densities, and existing solutions do not effectively manage coolant flow to maintain safe operating temperatures.
Innovation Solution
A pump apparatus with a primary and secondary chamber, where a primary fluid flow drives a rotational element to generate a secondary fluid flow, using a heat transfer element between the chambers to manage coolant flow and transfer heat from a heat source, preventing direct exposure of the primary fluid to electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is used for electronic equipment, then heat transfer efficiency is improved, but the risk of leakage and corrosion increases
Solution Approach 1:
The cooling system is divided into two separate chambers: a primary chamber containing the liquid coolant and a secondary chamber containing the electronic components. The primary rotational element rotates in the primary chamber while the secondary rotational element rotates in the secondary chamber, preventing direct contact between the coolant and electronics, thus eliminating leakage and corrosion risks while maintaining effective heat transfer.
Solution Approach 2:
A heat transfer element acts as an intermediary between the primary and secondary chambers, enabling thermal energy transfer from the electronic components to the coolant without requiring direct fluid contact. This mediator allows the system to achieve efficient cooling while maintaining system reliability by preventing coolant exposure to sensitive components.
2Temperature
If liquid cooling is used for high power density applications, then safe heat dissipation is achieved, but the system weight increases
Solution Approach 1:
The system utilizes the thermal energy from electronic components to drive the cooling mechanism itself. The temperature difference between the hot electronics and the cooler coolant creates natural convection currents and thermal expansion effects that automatically circulate the coolant without requiring additional heavy pumping infrastructure, reducing overall system weight while maintaining effective heat dissipation.
3Device complexity
If a single rotational element is used in the pump, then device complexity is reduced, but the ability to manage separate primary and secondary fluid flows is limited
Solution Approach 1:
Two rotational elements are merged into a single integrated pump assembly that rotates on the same axis. The primary rotational element manages the coolant flow in the primary chamber while the secondary rotational element manages the fluid flow in the secondary chamber, allowing independent control of both fluid systems within a unified compact structure that does not significantly increase overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system effectively generates and manages coolant flow, reducing the operating temperature of the secondary fluid by transferring heat from the heat source, while minimizing corrosion risks and weight concerns, making it suitable for applications with lower power densities.
Implementation Method 1
a heat transfer element positioned between the primary chamber the secondary chamber
Implementation Method 2
receiving a primary fluid in the primary chamber with a primary fluid flow, which rotates the primary rotational element
Implementation Method 3
The primary rotational element is coupled with the secondary rotational element along the axis. A secondary fluid flow is generated in the secondary chamber by the primary rotational element causing rotation of the secondary rotational element on the axis
Data Source
AI summary
The embodiments described herein relate to generating fluid flow. A pump is positioned adjacent to a heat source. The pump includes a primary chamber having a primary rotational element configured to rotate on an axis, and a secondary chamber having a secondary rotational element configured to rotate on the axis, with a heat transfer element positioned between the primary chamber and the secondary chamber. The primary rotational element is coupled with the secondary rotational element along the axis. A primary fluid is received in the primary chamber with a primary fluid flow, which rotates the primary rotational element. A secondary fluid flow is generated in the secondary chamber by the primary rotational element causing a rotation of the secondary rotational element on the axis.


