Dual-Chamber Vacuum Cluster Tool Without Substrate Transfer
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Solution Overview
Problem
Existing vacuum system cluster tools are complex, costly, and time-consuming due to mechanical sample transfer and multiple chambers, with a high risk of errors and inefficiency in semiconductor manufacturing processes.
Innovation Solution
A compact vacuum system cluster tool design that integrates chemical vapor deposition (CVD) and physical vapor deposition (PVD) chambers with a dividing gate valve, eliminating mechanical sample transfer and allowing automated, simultaneous deposition processes without substrate movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If mechanical sample transfer means and multiple chambers are used, then different deposition techniques (CVD and PVD) can be combined, but the system complexity and cost increase significantly
Solution Approach 1:
The patent merges CVD and PVD deposition techniques into a single integrated chamber, eliminating the need for multiple separate chambers and mechanical transfer means. The substrate holder remains stationary while deposition sources for both CVD and PVD are positioned around the substrate, allowing sequential or simultaneous deposition processes without substrate movement between chambers.
Solution Approach 2:
The single chamber is designed to perform multiple deposition functions (both CVD and PVD) using a universal substrate holder that can accommodate different deposition sources. The chamber serves as a multi-functional environment that supports various deposition techniques through configurable source positioning rather than requiring separate dedicated chambers for each technique.
2Adaptability or versatility
If mechanical transfer means are used to move samples between chambers, then different deposition processes can be performed, but the processing time increases
Solution Approach 1:
By combining CVD and PVD sources within a single chamber, the patent eliminates the time-consuming mechanical transfer process between chambers. The substrate remains stationary on the substrate holder while deposition sources are positioned and activated sequentially or simultaneously, reducing processing time while maintaining process variety.
Solution Approach 2:
The patent employs dynamic positioning of deposition sources rather than moving the substrate. The sources can be positioned and repositioned around the stationary substrate holder, allowing flexible process sequencing without mechanical substrate transfer, thus reducing processing time while maintaining adaptability.
3Productivity
If multiple chambers with mechanical transfer are used, then more deposition steps can be performed, but the risk of mechanical failure and errors increases
Solution Approach 1:
The patent combines multiple deposition capabilities in a single chamber, eliminating the need for mechanical transfer between multiple chambers. This reduces the number of mechanical components and transfer operations, thereby reducing the risk of mechanical failure and errors while maintaining the ability to perform multiple deposition steps.
Solution Approach 2:
The patent extracts and eliminates the mechanical transfer mechanism from the system by performing all deposition steps within a single chamber. This removal of unnecessary mechanical components directly reduces the risk of mechanical failure and operational errors while maintaining full deposition functionality.
4Adaptability or versatility
If substrate movement and rotation are required for processing, then complete surface coverage is achieved, but the system complexity increases
Solution Approach 1:
Instead of moving or rotating the substrate to achieve complete surface coverage, the patent inverts the approach by keeping the substrate stationary and moving/positioning the deposition sources around the substrate. This eliminates the need for complex substrate manipulation mechanisms while achieving the same surface coverage capability through source positioning flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates faster and more reliable multilayer deposition with reduced operational costs and minimized mechanical failure risks, enabling full automation and efficient use of chamber resources.
Implementation Method 1
at least one chemical vapour deposition chamber (1)
Implementation Method 2
at least one physical vapour deposition chamber (3)
Data Source
Figure 1a~1b
Figure 2
AI summary
The disclosed invention comprises a vacuum system cluster tool (0), comprising a dual chamber setup with at least one chemical vapour deposition chamber (1) and at least one physical vapour deposition chamber (3), with corresponding chemical vapour deposition means (10, 11, 12, 13) and corresponding physical vapour deposition means (30, 31, 32, 33) attached, as compact inexpensive, simply constructed vacuum system cluster tool (1) without mechanical sample transfer is created. Such a system cluster tool (0) is reached such that the at least one chemical vapour deposition chamber (1) and the at least one physical vapour deposition chamber (3) are divided by a gate valve (2) but directly connected on two opposite sides to the gate valve (2), whereby a CVD or ALD preparation step with closed gate valve (2) onto the surface (400) and a subsequent PVD deposition after opening the gate valve (2) can be performed, while the physical vapour deposition is carried out through the physical vapour deposition chamber (3) and completely through the opening of the gate valve (2) onto the surface (400) of the substrate (40), which can also be repeated in several cycles and whereby a substrate (40) transfer out of the chemical vapour deposition chamber (1) or a linear substrate (40) movement is not necessary.