Dual-Channel Substrate Temperature Plate with Counter-Flow Fluid
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Solution Overview
Problem
Current semiconductor substrate temperature adjustment apparatuses result in non-uniform heating or cooling, leading to decreased productivity and increased time required to achieve desired temperatures due to temperature disparities across the substrate.
Innovation Solution
A plate with dual channels, where one channel has a first inlet and outlet, and the second channel has a second inlet adjacent to the first outlet and second outlet adjacent to the first inlet, allowing fluids to flow in opposite directions to uniformly adjust the substrate's temperature, with an adiabatic member to prevent heat transfer between the fluids, and a flow rate adjusting section to optimize fluid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single channel is used to pass fluid for heating or cooling the substrate, then the device structure is simple, but the temperature distribution across the substrate becomes non-uniform
Solution Approach 1:
The single channel is divided into multiple channels (first channel and second channel) that flow in opposite directions. Each channel serves a specific region of the substrate, allowing independent temperature control and achieving uniform temperature distribution across the entire substrate surface.
Solution Approach 2:
The second channel is configured to flow in the opposite direction to the first channel. This counter-flow arrangement ensures that the inlet of one channel is adjacent to the outlet of the other, creating symmetric heat distribution patterns that eliminate temperature gradients across the substrate.
2Device complexity
If fluid flows through a single channel from one end to the other, then the device structure is simple, but the time required to heat or cool the substrate increases
Solution Approach 1:
The fluid flow path is segmented into parallel channels, allowing simultaneous heating or cooling of different substrate regions. This parallel processing approach reduces the overall time required to achieve uniform temperature across the substrate compared to sequential single-channel flow.
Solution Approach 2:
The dual-channel counter-flow configuration ensures continuous and simultaneous thermal action across the entire substrate surface. Both channels operate concurrently to heat or cool different regions, maintaining continuous useful thermal action rather than sequential processing.
3Speed
If the inlet and outlet are positioned at opposite sides of the plate, then fluid flow is efficient, but temperature uniformity across the substrate deteriorates
Solution Approach 1:
The second channel's inlet is positioned adjacent to the first channel's outlet, and the second channel's outlet is adjacent to the first channel's inlet. This inverted or counter-flow configuration maintains efficient fluid flow through each channel while creating symmetric heat distribution that ensures temperature uniformity across the substrate.
Solution Approach 2:
Each channel is optimized for its specific flow direction and position, with the first channel flowing in one direction and the second channel flowing in the opposite direction. This local optimization of flow characteristics in each channel contributes to overall temperature uniformity while maintaining efficient fluid flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform temperature adjustment across the substrate, enhancing productivity by reducing temperature disparities and shortening the time needed to reach desired temperatures.
Implementation Method 1
a first channel having a first inlet and a first outlet and passing a first fluid therethrough to adjust the temperature of the substrate, and a second channel having a second inlet and a second outlet and passing a second fluid therethrough to adjust the temperature of the substrate
Implementation Method 2
passing a first fluid therethrough to adjust the temperature of the substrate
Implementation Method 3
an adiabatic member may be disposed between the first channel and the second channel to block heat transfer between the first fluid and the second fluid
Data Source
AI summary
In a plate for adjusting a temperature of a substrate, a body of the plate supports the substrate. A first channel and a second channel are disposed within the body of the plate. The first channel has a first inlet and a first outlet and passes therethrough a first fluid to adjust the temperature of the substrate. The second channel has a second inlet adjacent to the first outlet and a second outlet adjacent to the first inlet and passes therethrough a second fluid to adjust the temperature of the substrate. Further, the first and second channels are disposed side by side. Thus, the temperature of the substrate may be adjusted uniformly as a whole.