Dual Chip Guard Wafer Structure Against Scribe Lane Moisture

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Solution Overview

Problem

Existing semiconductor wafers lack effective protection structures to prevent moisture penetration and propagation of defects from the scribe lane region to the chip regions, which can damage integrated circuits.

Innovation Solution

The semiconductor wafer includes a first chip guard surrounding the chip regions and a second chip guard surrounding the scribe lane region, both connected to a ground well through a test circuit pattern, forming a barrier to moisture and defects, with the second chip guard maintaining a ground state via a ground wiring layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a guard ring is disposed in the outer region of chip regions to prevent moisture penetration, then the integrated circuits are protected from moisture damage, but the scribe lane region remains vulnerable to moisture and defect propagation

Engineering Contradiction:

Improveprotection of integrated circuitsVSAvoidmoisture penetration in scribe lane region

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The protection structure is divided into two segments: a first chip guard in the chip sealing region and a second chip guard in the scribe lane region. This segmentation allows each guard to address specific protection needs in different regions, with the second chip guard specifically targeting moisture and defect propagation in the scribe lane area.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The second chip guard acts as an intermediary barrier between the scribe lane region and the chip regions. It prevents moisture and defects in the scribe lane from propagating to the chip regions, while the ground wiring layer provides an electrical pathway to dissipate any accumulated charges.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Stability of the object's composition

If the second chip guard is electrically connected to ground via ground wiring layer, then electrical stability is improved, but the device structure becomes more complex

Engineering Contradiction:

Improveelectrical stabilityVSAvoidstructure complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The second chip guard is merged with the ground wiring layer to form an integrated protection structure. This combination achieves dual functionality: physical barrier against moisture/defects and electrical grounding for stability, while reducing the number of separate components and simplifying the overall device structure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The second chip guard structure serves multiple functions simultaneously: it acts as a physical barrier against moisture and defect propagation, provides electrical grounding through the ground wiring layer, and maintains structural integrity. This multi-functionality reduces the need for additional separate protection mechanisms.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12451444B2Semiconductor wafer including chip guard

Publication Date: 2025.10.21 SK HYNIX INC

AI summary

A semiconductor wafer includes at least one chip region disposed in a substrate, a first chip guard disposed over the substrate in a chip sealing region positioned outside the at least one chip region, a second chip guard disposed over the substrate in a scribe lane region positioned outside the chip sealing region, and a test circuit pattern disposed in the scribe lane region and including a ground line electrically connected to a ground well in the substrate. The second chip guard includes a ground wiring layer electrically connected to the ground line of the test circuit pattern.