Dual Semiconductor Chip Interconnect for Low-EMI High-Current Modules
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Solution Overview
Problem
Existing semiconductor modules face reliability issues due to small contact surfaces in bonding wires, electromagnetic interference, and insufficient current-carrying capacity in flexible plates, leading to mechanical stress and temperature-related problems.
Innovation Solution
A semiconductor module design incorporating a first connecting element in surface contact with the semiconductor chip and substrate, combined with a second connecting element in the form of a wire or strip, which enhances current-carrying capacity and minimizes electromagnetic interference by providing a low-inductance commutation path and improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are used for contacting semiconductor chips, then the contact surface is relatively small, but electromagnetic interference occurs and current-carrying capacity is insufficient
Solution Approach 1:
The electrical connection is divided into two separate connecting elements: a first connecting element (flexible plate) that provides large contact surface area and low inductance, and a second connecting element (wire or strip) that provides high current-carrying capacity. This segmentation allows each element to optimize for its specific function without compromise.
Solution Approach 2:
The patent combines two different connecting element types (flexible plate and wire/strip) into a single hybrid connection system. The first connecting element provides broad surface contact while the second element provides concentrated current path, merging the advantages of both approaches to eliminate electromagnetic interference while maintaining high current capacity.
2Object-affected harmful factors
If flexible plates are used with large contact surface area, then electromagnetic interference is reduced, but current-carrying capacity is insufficient due to low layer thickness
Solution Approach 1:
The current-carrying function is separated from the electromagnetic shielding function. The first connecting element (flexible plate) handles electromagnetic interference reduction through large surface area, while the second connecting element (wire or strip) handles current-carrying capacity through concentrated conductive material.
Solution Approach 2:
The hybrid connection system uses composite construction combining flexible plate material and wire/strip material, each selected for optimal properties. The flexible plate provides low inductance and EMI reduction, while the wire or strip provides high current capacity, creating a composite solution that exceeds the capabilities of either material alone.
3Quantity of substance
If the layer thickness of the connecting element is increased to improve current-carrying capacity, then the connecting element becomes less flexible and cannot accommodate thermal expansion
Solution Approach 1:
The flexibility function and current-carrying function are assigned to different connecting elements. The first connecting element (flexible plate) maintains thin layer thickness to preserve flexibility and thermal expansion accommodation, while the second connecting element (wire or strip) provides the necessary current-carrying capacity without flexibility requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual connecting element configuration ensures a robust and reliable electrical connection with increased current-carrying capacity and reduced electromagnetic interference, while accommodating thermal expansion, thus enhancing the performance and reliability of semiconductor modules.
Implementation Method 1
bonding wires have the drawback that electromagnetic interference can occur within the semiconductor module and thus electromagnetic compatibility (EMC) is not sufficiently guaranteed
Implementation Method 2
the load in a bonding wire can increase the temperature. This can result in thermal expansion and hence in mechanical stress
Data Source
AI summary
A semiconductor module includes a substrate, a semiconductor chip arranged on the substrate, and a first connecting element for electrically connecting the semiconductor chip to a conductor track and/or to a further component of the semiconductor module. At least part of the first connecting element lies in surface contact with the semiconductor chip and the substrate and also the conductor track and/or the further component. The semiconductor module includes a second connecting element for electrically connecting the semiconductor chip to the conductor track and/or to the further component. The second connecting element is configured in the form of a wire or a strip.