Dual-Chip Electronic Package Plating Against Ion Migration
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Solution Overview
Problem
Existing electronic component packages face challenges in maintaining operational reliability due to ion migration phenomena, particularly when using silver-based plated layers, which can lead to insulation breakdown and leakage currents.
Innovation Solution
Employing plated layers made of metal materials like gold, palladium, or nickel that are less susceptible to ion migration, ensuring electrical insulation and independent operation of multiple electronic component chips within the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silver-based plated layers are used, then electrical conductivity is improved, but ion migration phenomenon occurs leading to insulation breakdown
Solution Approach 1:
The patent changes the material parameter of the plated layer from silver to a composite structure (silver core with nickel or palladium outer layer). This parameter change maintains the electrical conductivity benefits of silver while eliminating the ion migration problem through the protective outer layer.
Solution Approach 2:
The patent employs composite plated layers consisting of a silver core surrounded by an outer layer of nickel or palladium. This composite structure combines the high conductivity of silver with the ion migration resistance of nickel or palladium, resolving the contradiction between conductivity and reliability.
2Productivity
If multiple electronic component chips are mounted on a single lead frame, then device integration is improved, but insulation breakdown risk increases due to ion migration
Solution Approach 1:
The composite plated layer structure (silver core with nickel/palladium outer layer) prevents ion migration between adjacent electronic component chips, enabling safe integration of multiple chips on a single lead frame while maintaining insulation integrity.
Solution Approach 2:
The nickel or palladium outer layer acts as an intermediary barrier between the silver core and the insulating layers, preventing direct ion migration pathways that would otherwise compromise insulation between multiple mounted chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances operational reliability by preventing ion migration, maintaining insulation integrity, and enabling redundant operation systems with separate power supplies for each chip, thus ensuring consistent performance even under varying temperature and humidity conditions.
Implementation Method 1
The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag)
Data Source
AI summary
An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).