Dual Chuck Cutting Machine for CSP Substrate Division
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Solution Overview
Problem
Existing cutting machines for CSP substrates with semiconductor chips require high precision, leading to poor cutting efficiency due to the need for exact precision in cutting, which is not necessary for CSP substrates.
Innovation Solution
A cutting machine with dual chuck tables and cutting units that move along guide rails, allowing for efficient cutting in multiple directions with precise alignment and index control, enabling efficient division of CSP substrates into individual semiconductor chips with less stringent precision requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high precision cutting is performed on CSP substrates using conventional dicing machines, then cutting precision is improved, but cutting efficiency deteriorates
Solution Approach 1:
The cutting machine is divided into multiple independent cutting units (first cutting unit with first cutting blade, second cutting unit with second cutting blade) that can operate simultaneously on different workpieces or different regions. This segmentation allows parallel processing, thereby improving cutting efficiency while maintaining required precision for CSP substrates without needing excessive precision
Solution Approach 2:
The invention introduces a vertical dimension (Z-axis) for blade movement in addition to the horizontal X-axis movement. The cutting blades can move vertically along guide rails to access different cutting positions, enabling multi-directional cutting operations. This dimensional expansion allows more efficient cutting paths and reduces the need for repeated positioning operations
2Productivity
If conventional single chuck table design is used, then device complexity is reduced, but cutting efficiency deteriorates due to sequential processing
Solution Approach 1:
The single chuck table is segmented into multiple independent chuck tables (first chuck table, second chuck table) that can hold and position multiple workpieces simultaneously. Each chuck table can be independently indexed and positioned, enabling parallel processing of multiple CSP substrates or different regions of substrates, thereby significantly improving cutting efficiency
Solution Approach 2:
Multiple cutting units are designed with universal functionality to perform identical cutting operations on different workpieces or different regions. The first cutting unit and second cutting unit both具备 the capability to cut CSP substrates, allowing flexible allocation and parallel operation, which improves productivity while keeping each individual unit relatively simple
Data Source
AI summary
When a plate-shaped material, such as a CSP substrate, that does not require exact precision is divided, a cutting machine is provided with not only first and second chuck tables, but also first and second cutting units. Then, each plate-shaped material, which is placed on a respective chuck table, is aligned immediately before it is cut, so that the Y-axis index control and the X-axis cutting movement control are established for cutting by the cutting units. A cutting portion is cut in the first direction by the first cutting unit according to the Y-axis index control and the X-axis cutting movement control, and subsequently a cutting portion is cut in the second direction by the second cutting unit. Hence, the cutting portions of the plate-shaped materials placed on the first and second chuck tables are cut by the first and second cutting units by sharing a role.