Dual-Chuck Table Mechanism for Simultaneous IC Dicing and Sorting
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Solution Overview
Problem
Current dicing and sorting systems for integrated circuits face challenges in efficiently handling and sorting singulated units, particularly with ball grid array packages, due to limited sophistication in detection and handling techniques, which often result in batch rejection if a fault is identified, and the difficulty increases as integrated circuit size decreases and the margin around the array shrinks.
Innovation Solution
A substrate delivery and chuck system with a dual-chuck table and drive mechanism that allows simultaneous deposition and pickup of substrates and singulated units, combined with a lifting assembly for efficient handling and sorting, including vacuum suction and cleaning stages, to optimize the dicing and sorting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional handling devices are used to touch integrated circuits at the edges, then the risk of damage to the ball grid array is reduced, but the handling operation becomes increasingly difficult as circuit size decreases
Solution Approach 1:
The chuck table is divided into two independent chuck sections that can be positioned at different locations. One section handles substrate deposition while the other handles singulated unit pickup, allowing simultaneous independent operations that reduce handling difficulty while maintaining reliability
Solution Approach 2:
The drive mechanism continuously moves the chuck sections between locations, enabling simultaneous deposition and pickup operations. This continuous motion eliminates idle time and maintains productive action throughout the handling process, reducing overall operation difficulty
2Measurement precision
If batch sorting operations are performed on substrates with ball grid arrays, then faulty units can be detected, but the entire batch is rejected if any fault is identified
Solution Approach 1:
The system processes and inspects singulated units individually rather than as batches. The chuck sections handle units separately, allowing precise fault detection at the individual unit level while preventing batch-wide rejection, thereby maintaining both measurement precision and productivity
Solution Approach 2:
Cameras positioned under the chuck sections provide real-time feedback on the condition of singulated units. This immediate feedback allows for individual unit assessment and sorting decisions, enabling precise fault detection without compromising overall productivity through batch rejection
3Productivity
If a dual-chuck table system is implemented for simultaneous deposition and pickup operations, then handling efficiency and UPH rate are improved, but device complexity increases
Solution Approach 1:
The dual-chuck table system divides the handling function into two independent sections, each capable of independent operation. This segmentation allows simultaneous deposition and pickup operations, doubling the effective throughput while keeping each individual chuck section relatively simple in design
Solution Approach 2:
Both chuck sections can perform both deposition and pickup operations depending on their position and the operational cycle. This multi-functionality allows the system to achieve high productivity through coordinated operation of universal components rather than requiring specialized complex mechanisms for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system enhances the efficiency and accuracy of dicing and sorting integrated circuits by enabling rapid and precise handling of substrates and singulated units, reducing damage risk and improving the Unit per Hour (UPH) rate, while allowing for real-time quality inspection and categorization.
Implementation Method 1
A substrate delivery and chuck system with a dual-chuck table and drive mechanism that allows simultaneous deposition and pickup of substrates and singulated units, combined with a lifting assembly for efficient handling and sorting, including vacuum suction
Data Source
AI summary
A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).


