Dual CMOS Camera System for PCB Component Alignment
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Solution Overview
Problem
Current camera systems for aligning components on printed circuit boards (PCBs) are costly and complex due to the use of expensive CCD cameras with bulky optical zoom lenses and split prisms, which are required for high definition imaging of smaller components with finer ball pitch dimensions in BGA rework applications.
Innovation Solution
A dual camera system with CMOS image sensors mounted on a fixture, each without prisms, captures images of the component and its footprint on the PCB, and processes these signals to display a superimposed image for alignment, allowing for precise placement without the need for external optical systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If CCD camera with optical zoom lens and split prism is used, then high definition imaging capability is improved, but system cost and complexity increase
Solution Approach 1:
The patent extracts and removes the complex optical components (prisms, optical zoom lenses) from the imaging system, replacing them with simpler CMOS image sensors that achieve high definition imaging through digital processing rather than complex optical paths
Solution Approach 2:
The patent replaces the mechanical/optical system (prisms and lenses for image manipulation) with a digital/electronic system (CMOS sensors and image processing circuits), substituting physical optical manipulation with electronic signal processing
2Measurement precision
If CCD camera with optical zoom lens and split prism is used, then high definition imaging capability is improved, but system cost increases
Solution Approach 1:
The patent employs inexpensive CMOS image sensors instead of expensive CCD cameras, using cost-effective components that achieve the required imaging performance through digital processing rather than expensive optical hardware
Solution Approach 2:
The patent removes the expensive optical components (prisms, optical zoom lenses) from the system, eliminating the need for costly precision optical manufacturing and assembly
3Manufacturing precision
If larger field of view and high magnification are required for smaller components, then alignment precision is improved, but optical system complexity increases
Solution Approach 1:
The patent replaces complex optical zoom mechanisms with digital zoom capabilities in CMOS sensors, achieving variable magnification through image processing rather than mechanical optical adjustment
Solution Approach 2:
The patent provides dynamic adjustment of field of view and magnification through electronic control of CMOS sensor parameters and digital processing, replacing fixed or mechanically-adjusted optical systems with electronically-adaptable imaging
Data Source
AI summary
A camera system and associated method for aligning a component with a footprint on a PCB including: a housing having a first side and a second side opposite to the first side; a first image sensor positioned on the first side of the housing and pointing to a first direction away from the housing to capture an image of the component and generating a first image signal, wherein the first image sensor includes a first lens assembly without a prism; a second image sensor positioned on the second side of the housing and aligned with the first image sensor pointing to a second direction opposite to the first direction to capture an image of the footprint on the PCB and generating a second image signal, wherein the second image sensor includes a second lens assembly without a prism; a mixing circuit for mixing the first image signal with the second image signal and generating a mixed image signal; and a processor for processing the mixed image signal and displaying a superimposed image of the component and the footprint on a display monitor.