Dual-Compartment Computing Enclosure with Hub Gap for Airflow
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Solution Overview
Problem
Conventional liquid cooling systems for computing devices are inefficient due to standard form factors that do not allow for optimal space use, leading to preheating of air before it reaches radiators, increased system complexity, and wasted space from complex tubing networks for multiple cold plates.
Innovation Solution
A computing device enclosure with a dual-compartment design where a first compartment houses heat-generating components and a liquid cooling device, and a second compartment with air inlets and outlets houses a heat exchanger, connected by a hub to create a gap for efficient air flow and reduce preheating, allowing for optimized thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional liquid cooling systems use standard form factors and multiple radiators, then the system can be assembled using standard components, but the space utilization is inefficient and air is preheated before reaching the radiators
Solution Approach 1:
The patent merges multiple radiators into a single integrated radiator structure that serves multiple cooling zones. This consolidation eliminates the need for separate standard-form-factor radiators, improving space utilization while maintaining assembly simplicity through a unified design.
Solution Approach 2:
The patent introduces a vertical gap between the first and second compartments, creating a three-dimensional airflow path. This dimensional change allows cool air to reach the radiator directly without being preheated by components in the first compartment, improving cooling efficiency without increasing horizontal footprint.
2Reliability
If multiple cold plates are used for various high power devices, then each component can be cooled individually, but the tubing network complexity and system size increase
Solution Approach 1:
The patent combines multiple cold plates into a single integrated cold plate structure with multiple cooling zones. This unified cold plate reduces the number of separate tubing connections needed while maintaining individual cooling capability for each high-power component, thereby reducing tubing network complexity.
Solution Approach 2:
The integrated cold plate serves multiple functions by providing cooling to various high-power devices through a single component. This multi-functional design eliminates the need for separate cold plates and their associated tubing networks, reducing overall system complexity.
3Volume of moving object
If air is drawn through the first compartment before reaching the second compartment with radiators, then the cooling system can be compact, but the air is preheated reducing radiator efficacy
Solution Approach 1:
The patent creates a vertical separation and gap between compartments, establishing a direct airflow path from the second compartment's air inlet through the radiator to the air outlet. This three-dimensional arrangement allows cool air to bypass the first compartment entirely, reaching the radiator at ambient temperature while maintaining system compactness.
Solution Approach 2:
The patent segments the enclosure into distinct compartments with dedicated airflow paths. The second compartment is designed as an independent airflow zone with its own inlet and outlet, allowing it to function as a separate cooling channel that does not depend on air passing through the first compartment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal management by preventing preheating of air before it reaches the heat exchanger, reducing system complexity, and optimizing space usage, thereby improving cooling efficiency and reducing assembly complexity.
Implementation Method 1
The liquid cooling device is in thermal contact with the first heat generating component and the second heat generating component
Implementation Method 2
a heat exchanger to remove heat transferred to the liquid cooling device
Implementation Method 3
A hub connects the second compartment to the first compartment in a spaced apart relation so as to leave a gap between the first upper side of the compartment and the lower side of the second compartment
Data Source
AI summary
Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.