Dual-Conductivity Pressure Sensor Cover for Output Stability

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Solution Overview

Problem

Pressure sensors used in high temperature and pressure environments, such as those found in semiconductor manufacturing, experience output instability due to temperature changes and inhomogeneity, particularly when designed as compact, protruding components.

Innovation Solution

A cover component comprising a hollow member with high thermal conductivity and a lid member with low thermal conductivity is used to thermally insulate and equalize the temperature of the pressure sensor, preventing output instability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the pressure sensor is designed as a compact protruding component, then the device size is reduced and space is saved, but temperature inhomogeneity increases and output stability deteriorates

Engineering Contradiction:
Improvedevice sizeVSAvoidoutput stability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

A cover component is introduced as an intermediary element between the pressure sensor and the high-temperature environment. This cover acts as a thermal mediator that equalizes temperature distribution across the sensor surface, preventing direct exposure to temperature gradients while maintaining the compact protruding design.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The cover component is designed with differentiated thermal properties - having regions with different thermal conductivities to optimize heat distribution. The cover's structure provides localized thermal management, ensuring uniform temperature across the sensor active area while allowing the overall device to remain compact.

Inventive Principle:
Principle #3Local quality

2Temperature

If the pressure sensor is exposed to high temperature environment, then the sensor can operate in high temperature gas measurement applications, but temperature changes cause output instability

Engineering Contradiction:
Improveoperating temperature rangeVSAvoidoutput stability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The cover component serves as a thermal intermediary that buffers the sensor from direct high-temperature exposure. It creates a controlled thermal environment for the sensor while allowing the device to operate in high-temperature gas measurement applications.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The cover component modifies the thermal parameters at the sensor surface, transforming the harsh high-temperature environment into a more stable thermal condition for the sensor, thereby maintaining output stability across a wide operating temperature range.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If thermal insulation is added to protect the sensor from high temperature, then output stability improves, but device complexity increases

Engineering Contradiction:
Improveoutput stabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The cover component performs multiple functions simultaneously: it provides thermal insulation, equalizes temperature distribution, protects the sensor from direct heat exposure, and maintains the compact device form factor. This multi-functionality avoids the need for separate complex thermal management systems.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The cover component integrates several protective and thermal management functions into a single structural element, combining insulation, temperature equalization, and mechanical protection in one piece, thereby avoiding increased device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures stable sensor output by maintaining thermal equalization, thereby ensuring precision and accuracy in high-temperature environments.

Implementation Method 1

a hollow member 3a having an inner peripheral surface facing a side surface of the protrusion portion (11) of the pressure sensor (1)

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a lid member 3b fixed to the hollow member 3a for covering the protrusion portion (11) of the pressure sensor (1)

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS12405182B2Cover component for pressure sensor, and pressure sensor device comprising same
Publication Date: 2025.09.02 FUJIKIN INC
  • US12405182B2 patent drawing
  • US12405182B2 patent drawing
  • US12405182B2 patent drawing

AI summary

A cover component 3 is used for a pressure sensor 1 that is fixed to a mounting surface 5S of a body 5 with a flow path F1 formed therein, and that has protrudes protruding from the mounting surface 5S, the cover component comprising a hollow member 3a having an inner peripheral surface facing a side surface of the protruding portion of the pressure sensor 1, and a cover member 3b fixed to the hollow member 3a and covering the protruding portion of the pressure sensor 1.