Dual-Container Immersion Cooling System for Electronic Devices
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Solution Overview
Problem
Current immersion cooling systems for electronic components face challenges in efficiently cooling high-heat devices while minimizing energy consumption, as they often require significant energy for liquid circulation and additional equipment to enhance convection.
Innovation Solution
The proposed immersion cooling system employs a dual-container setup with a first container filled with a heat-transfer liquid and a second container immersed within it, utilizing a pump for circulation and liquid cooling units to manage thermal energy, along with a heat-exchanger to optimize temperature control between 30° C and 55° C, and potentially incorporating Phase Change Materials (PCMs) and dielectric liquids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If pumps are used to circulate dielectric cooling liquid at high levels to cool hottest devices, then cooling effectiveness is improved, but energy consumption increases significantly
Solution Approach 1:
The cooling system is segmented into multiple zones with different cooling requirements. Hottest devices are positioned in zones with enhanced cooling (higher liquid levels, additional cooling elements), while cooler zones have standard cooling. This allows targeted cooling where needed most, reducing overall energy consumption compared to uniform high-level circulation throughout the entire container.
Solution Approach 2:
Different regions of the cooling container are provided with different cooling intensities. Areas with hottest devices receive enhanced cooling through additional cooling elements and higher liquid levels, while other areas have standard cooling conditions. This local differentiation optimizes cooling effectiveness for high-heat devices without unnecessarily consuming energy throughout the entire system.
2Temperature
If additional equipment such as immersed serpentine copper coils are added to enhance convection, then cooling performance is improved, but device complexity increases
Solution Approach 1:
Multiple cooling functions are merged into integrated cooling elements that combine convection enhancement and heat dissipation in single components. These integrated elements replace the need for separate serpentine copper coils and other additional equipment, reducing system complexity while maintaining enhanced cooling performance for the hottest devices.
3Temperature
If dielectric cooling liquid is circulated at high levels to ensure sufficient cooling for hottest devices, then thermal contact is improved, but liquid volume requirements increase
Solution Approach 1:
The cooling container is divided into multiple zones with different liquid levels. Hottest devices are positioned in zones with higher liquid levels to ensure adequate thermal contact, while cooler zones have lower liquid levels. This segmentation reduces the total liquid volume required compared to filling the entire container at high level, while still providing sufficient cooling where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal energy management, reduces energy consumption, and effectively maintains optimal temperature ranges for cooling electronic devices, addressing the inefficiencies of previous systems by promoting efficient heat transfer and circulation.
Implementation Method 1
the first heat-transfer liquid collects, in use, at least a portion of a thermal energy generated by the one or more heat-generating components
Implementation Method 2
Good thermal contact is obtained between the electronic components and the dielectric cooling liquid
Implementation Method 3
a heat-exchanger to optimize temperature control between 30° C and 55° C
Implementation Method 4
a pump configured to cause a circulation of the second heat-transfer liquid from the main liquid inlet to the main liquid outlet
Implementation Method 5
potentially incorporating Phase Change Materials (PCMs)
Implementation Method 6
a non-conducting cooling liquid, for example an oil-based dielectric cooling liquid
Data Source
AI summary
Systems for cooling one or more electronic devices are disclosed, each of the one or more electronic devices including one or more heat-generating components. An immersion cooling includes a first container adapted for receiving a first heat-transfer liquid, the one or more electronic devices being, at least in part, immersed in the first heat-transfer liquid such that the first heat-transfer liquid collects, in use, at least a portion of a thermal energy generated by the one or more heat-generating components and a second container adapted for receiving a second heat-transfer liquid, the first container being, at least in part, immersed in the second container cooling system.