Dual-Cooling Electronic Package for Electric Machines
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Solution Overview
Problem
Current electric machine technologies require separate, custom-designed electronics for air-cooled and liquid-cooled applications, leading to duplicated investment costs due to physical layout differences dictated by cooling media, with no existing solutions allowing for common electronics across both types.
Innovation Solution
An electronic package for electric machines that is adaptable to both air-cooled and liquid-cooled systems, featuring a cooling tower with radially distributed power modules and bi-directional cooling paths, allowing for shared components and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate custom-designed electronics are used for air-cooled and liquid-cooled electric machines, then the physical layout requirements for each cooling type are satisfied, but the investment cost is doubled due to duplicated electronics assemblies and components
Solution Approach 1:
The electronic package is designed with a universal cooling tower structure that can serve both air-cooled and liquid-cooled electric machines. The cooling tower includes a heat sink with radially distributed mounting surfaces for power modules, and cooling media flow paths that can accommodate either air or liquid cooling configurations, allowing the same electronics to be used across different cooling applications
Solution Approach 2:
The electronic package is divided into modular components including the cooling tower, power modules with heat sinks, and control electronics. This segmentation allows the same modular electronic package to be adapted to different cooling types by configuring the cooling media flow paths, while maintaining the core electronic components and structure
2Reliability
If separate custom-designed electronics are used for air-cooled and liquid-cooled electric machines, then the specific cooling requirements are met, but the manufacturing complexity increases due to customized components and layouts
Solution Approach 1:
The electronic package employs a universal design where the cooling tower and power module arrangement can accommodate both air and liquid cooling media. The heat sink structure with radially distributed mounting surfaces and configurable cooling paths eliminates the need for different electronic configurations, reducing manufacturing complexity while maintaining cooling efficiency
3Ease of manufacture
If common electronics are used for both air-cooled and liquid-cooled electric machines, then the investment cost is reduced, but the physical layout must accommodate both cooling types simultaneously
Solution Approach 1:
The electronic package incorporates dynamic adaptability through configurable cooling paths within the cooling tower structure. The same physical layout can be adapted to different cooling media (air or liquid) by adjusting the flow path configuration, allowing the electronics to serve both cooling types without requiring separate custom designs
Solution Approach 2:
The cooling tower is designed as a universal structure with heat sink surfaces and cooling channels that can accommodate either air or liquid cooling. This multi-functional design enables the same electronic package to be used across different cooling applications, reducing investment costs while maintaining adaptability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of common electronics for both cooling types, reducing production costs and improving cooling efficiency through parallel cooling paths, while maintaining design flexibility and structural integrity.
Implementation Method 1
Heat transference from the power module of the power electronics device occurs along a cooling path from the power electronics device to the heat sink
Implementation Method 2
Transference along the cooling paths of heat from the heat sink includes thermal convection to air and/or liquid
Data Source
AI summary
An electronic package adapted for connection to a rear frame member of an electric machine of liquid and/or air-cooled type. The electronic package includes a cooling tower having opposite first and second axial ends spaced along a package central axis. The cooling tower includes a metallic wall extending about the package central axis to define a radially outer wall surface. The cooling tower is at ground potential and defines a heat sink. The electronic package also includes a plurality of power modules mounted in conductive thermal communication to the cooling tower at positions on the radially outer wall surface. Heat transference to the cooling tower from each power module occurs along a respective primary cooling path. Transference along the primary cooling paths of heat from the cooling tower includes thermal convection to air and/or liquid. An electric machine of liquid and/or air-cooled type including an electronic package is also disclosed.