Dual Cooling Arrangement With Flow-Loss Detection for Electronics

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Solution Overview

Problem

Current flowmeters for electronic device cooling are bulky, expensive, and unable to detect cooling losses at the component level, leading to potential rapid overheating and data loss in data centers.

Innovation Solution

A compact flow detection device that uses a float and sensor to monitor liquid flow in cooling systems, providing a binary indication of sufficient cooling fluid presence, integrated with a processor to manage cooling fluid delivery and activate secondary cooling measures when necessary.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional flowmeters are used to monitor cooling fluid flow, then cooling flow can be detected, but the devices are bulky and cannot be used in space-limited racks

Engineering Contradiction:
Improvecooling flow detectionVSAvoidflowmeter size
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The patent replaces conventional mechanical flowmeters with a magnetic field-based detection system. A flow sensor with a magnetic float and reed switch detects cooling fluid flow without mechanical moving parts, enabling compact integration into rack-mounted equipment while maintaining flow detection capability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The flow sensor utilizes a thin magnetic float that can move freely within the cooling fluid conduit. This thin-film approach allows the sensor to occupy minimal space while still effectively detecting the presence and flow of cooling fluid through magnetic field interaction.

Inventive Principle:
Principle #30Flexible shells and thin films

2Measurement precision

If conventional flowmeters are used to monitor cooling fluid flow, then cooling flow can be detected, but the devices are expensive and cannot be economically deployed to each component

Engineering Contradiction:
Improvecooling flow detectionVSAvoidcost-effectiveness
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent employs a cost-effective flow sensor design using inexpensive magnetic components (float and reed switch) that can be easily manufactured and deployed. This economical approach enables installation of individual flow monitoring at each rack or component level, allowing early detection of cooling failures before they cause expensive equipment damage or data loss.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The flow sensor system is designed for easy self-installation and maintenance. The magnetic float and reed switch configuration requires minimal calibration and can be easily replaced if needed, reducing deployment costs and enabling widespread use across multiple components without requiring expensive specialized installation services.

Inventive Principle:
Principle #25Self-service

3Temperature

If only primary liquid cooling is used, then cooling efficiency is high, but cooling failure occurs when impurities block conduits

Engineering Contradiction:
Improvecooling efficiencyVSAvoidcooling system stability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent implements a flow sensor that continuously monitors cooling fluid flow before it can be blocked by impurities. By detecting reduced or stopped flow early, the system can trigger alerts or activate backup cooling measures before complete cooling failure occurs, preventing overheating and equipment damage.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The flow monitoring system serves as a protective cushion against cooling failures. By detecting flow problems early, the system provides a warning buffer that allows time to respond before actual thermal damage occurs, cushioning against the harmful effects of cooling system failures.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

4Measurement precision

If flow monitoring is implemented at rack level only, then cooling delivery can be monitored, but component-level cooling losses cannot be detected

Engineering Contradiction:
Improvecooling delivery monitoringVSAvoidmonitoring system granularity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent divides the cooling monitoring function into modular flow sensors that can be installed at different hierarchical levels - rack level, shelf level, or individual component level. This segmentation allows flexible deployment where each sensor monitors a specific zone, enabling component-level detection of cooling losses without requiring a completely complex centralized system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The flow sensor design is universal and can be adapted to monitor cooling fluid flow at multiple levels of the cooling hierarchy. The same basic magnetic float and reed switch mechanism works whether monitoring a entire rack, a shelf, or an individual component, providing a scalable solution that increases monitoring granularity without proportionally increasing system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient and cost-effective monitoring of cooling fluid flow to individual components, preventing overheating and data loss by activating secondary cooling measures when primary flow is insufficient, thus ensuring safe operating temperatures and maintaining system reliability.

Implementation Method 1

A flow sensor, such as a float and sensor, may be used to detect a presence or absence of liquid flow

Methodology Applied
Scientific EffectBuoyancy: Archimedes' Principle (Buoyancy)

Implementation Method 2

A primary cooling device may be thermally connected to the electronic device and receives the cooling fluid from the fluidic input line, transfers heat from the electronic device to the cooling fluid

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The processor activates the secondary cooling device in response to receiving the indication that a sufficient flow of the cooling fluid is not being delivered to the cooling device

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentEP3703476B1Cooling arrangement having primary and secondary cooling devices for cooling an electronic device
Publication Date: 2022.07.20 OVH
  • EP3703476B1 patent drawingFigure 1
  • EP3703476B1 patent drawingFigure 2
  • EP3703476B1 patent drawingFigure 3

AI summary

A cooling arrangement for an electronic device comprises a primary cooling device and a secondary cooling device. The primary cooling device includes a fluidic input line receiving a cooling fluid from a cooling fluid source and a fluidic output line returning the cooling fluid toward a drain. The primary cooling device is thermally connected to the electronic device, receives the cooling fluid from the fluidic input line and transfers heat from the electronic device to the cooling fluid before returning the cooling fluid via the fluidic output line. A flow detection device monitors a flow of the cooling fluid in the primary cooling device. The secondary cooling device is thermally connected to the electronic device. A processor activates the secondary cooling device to absorb and dissipate heat from the electronic device when the flow detection device detects a lack of flow of the cooling fluid in the primary cooling device.