Dual Cooling Fluid Circuit for Lithographic Apparatus Heat Management
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Solution Overview
Problem
Lithographic apparatuses face inefficiencies in heat removal due to the limitations of single cooling fluid circuits, which can lead to reduced performance and increased energy consumption, especially in high-temperature applications like EUV radiation systems.
Innovation Solution
Implementing a dual cooling fluid circuit system with two heat exchangers operating at different temperatures to efficiently cool components, allowing for precise temperature control and enhanced heat dissipation, including the use of a first heat exchanger that cools to around 35°C or more and a second heat exchanger that further cools to around 30°C, and integrating this system within the lithographic apparatus, radiation system, and laser amplifier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single cooling fluid circuit is used, then the device complexity is reduced, but the heat removal efficiency deteriorates
Solution Approach 1:
The cooling system is segmented into two separate cooling fluid circuits: a first cooling fluid circuit for removing heat at a first temperature, and a second cooling fluid circuit for removing heat at a second temperature. This segmentation allows each circuit to be optimized for its specific temperature range, improving overall heat removal efficiency while managing the complexity through functional separation.
2Ease of operation
If a single cooling fluid circuit is used, then the ease of operation is improved, but the temperature control precision deteriorates
Solution Approach 1:
Different parts of the system receive different cooling temperatures according to their specific requirements. The first cooling fluid circuit maintains components at a first temperature, while the second cooling fluid circuit maintains other components at a second temperature. This local quality approach ensures each component operates at its optimal temperature, improving overall temperature control precision.
3Use of energy by moving object
If higher cooling temperatures are used, then the energy consumption is reduced, but the heat removal capacity deteriorates
Solution Approach 1:
The cooling system segments heat removal into two temperature levels. The first cooling fluid circuit operates at a higher temperature (lower energy consumption) for heat removal, while the second cooling fluid circuit operates at a lower temperature (higher heat removal capacity) when needed. This segmentation allows the system to optimize energy consumption by using the higher temperature circuit for routine cooling and the lower temperature circuit for high-heat-load conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This dual cooling system significantly improves heat removal efficiency, reduces energy consumption, and allows for accurate temperature control, enhancing the performance of lithographic apparatuses and associated systems, such as laser amplifiers, while also enabling waste heat recovery and building heating applications.
Implementation Method 1
a first cooling fluid circuit which is configured to cool components to a first temperature
Implementation Method 2
a second cooling fluid circuit which is configured to cool components to a second temperature that is lower than the first temperature
Implementation Method 3
enabling waste heat recovery and building heating applications
Data Source
AI summary
A lithographic apparatus comprising an illumination system configured to condition a radiation beam, a support structure constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, a substrate table constructed to hold a substrate, and a projection system configured to project the patterned radiation beam onto the substrate, the lithographic apparatus being provided with a first cooling fluid circuit which is configured to cool components to a first temperature, and provided with a second cooling fluid circuit which is configured to cool components to a second temperature that is lower than the first temperature.