Dual Cooling Member Assembly With Elastic Coupling
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Solution Overview
Problem
Conventional electronic devices face inefficiencies in mounting electronic components due to increased heat generation and heat density, which limits their cooling and mounting capabilities.
Innovation Solution
The electronic device employs a dual cooling member system with overlapping portions and a coupling mechanism using elastic members to reduce fixing regions on the substrate, allowing for improved mounting efficiency and cooling effectiveness by reducing the number of fixing members and enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple cooling members are mounted on the substrate to cool high heat-generating electronic components, then the cooling effectiveness is improved, but the number of fixing members increases and mounting efficiency deteriorates
Solution Approach 1:
The patent combines multiple cooling members (first cooling member and second cooling member) into a single integrated assembly that is mounted on the substrate as one unit. The coupling member joins the first and second cooling members together, allowing them to be fixed to the substrate simultaneously through a single mounting operation rather than separately, thus reducing the number of fixing members needed while maintaining effective cooling of multiple electronic components.
2Reliability
If the fixing regions on the substrate are increased to secure multiple cooling members, then the reliability of cooling member fixation is improved, but the available wiring region and mounting region are reduced
Solution Approach 1:
The patent merges multiple cooling members into a single integrated assembly that requires fewer fixing members on the substrate. By coupling the first and second cooling members together through the coupling member, the assembly can be secured to the substrate with fewer fixation points, thereby reducing the area occupied by fixing regions and increasing the available area for wiring and mounting other components.
Solution Approach 2:
The patent utilizes the vertical dimension by stacking the first and second cooling members in an overlapping configuration. The first cooling member is positioned at a first location on the substrate, while the second cooling member is positioned at a second location that overlaps with the first location in the plan view but is offset in the vertical direction. This three-dimensional arrangement allows multiple cooling functions to be achieved without proportionally increasing the footprint area on the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances mounting efficiency by reducing the number of fixing regions, allowing for higher component density and improved cooling performance by ensuring better contact and flexibility between cooling plates and electronic components.
Implementation Method 1
a coupling member inserted through the first insertion hole and the second insertion hole to couple the first overlapping portion to the second overlapping portion through an elastic member
Data Source
AI summary
An electronic device is described, which includes: a first cooling member having a first overlapping portion in which a first insertion hole is formed, and provided to be abutted on a first component to be cooled provided on a substrate; a second cooling member having a second overlapping portion in which a second insertion hole is formed, and provided to be abutted on a second component to be cooled provided on the substrate, the second overlapping portion overlapping the first overlapping portion; and a coupling member inserted through the first insertion hole and the second insertion hole to couple the first overlapping portion to the second overlapping portion through an elastic member.