Dual-Core PCB Power Architecture for AC/DC Decoupling
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Solution Overview
Problem
In advanced electronic packages, the efficient delivery of power is challenged by rapid current fluctuations, leading to issues like electromagnetic interference, alternating current ripple, and thermos-mechanical weaknesses, which traditional power delivery networks struggle to mitigate effectively.
Innovation Solution
A dual-core hybrid packaging structure is introduced, featuring a printed circuit board with an organic core for direct current capacitors and a glass core for alternating current capacitors, separated by an interposer layer to isolate the AC and DC domains, thereby decoupling unwanted AC effects from the power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If routing vias are used to carry signals to minimize electromagnetic interference and alternating current ripple, then electromagnetic interference and alternating current ripple are reduced, but voltage drop increases due to the length of the via
Solution Approach 1:
The power delivery network is segmented into multiple domains (DC domain and AC domain) separated by an interposer layer. DC capacitors are placed in the DC domain near the voltage source, while AC capacitors are placed in the AC domain near the die. This segmentation allows each domain to be optimized independently, reducing via length and voltage drop while maintaining electromagnetic interference and alternating current ripple reduction.
Solution Approach 2:
An interposer layer is introduced as an intermediary between the DC domain and AC domain. This interposer layer contains through-substrate vias that provide low-inductance connections, acting as a mediator that transfers power between domains while minimizing voltage drop and electromagnetic interference.
2Object-affected harmful factors
If routing vias are used to carry signals to minimize alternating current ripple, then alternating current ripple is reduced, but thermos-mechanical weaknesses increase
Solution Approach 1:
The package structure is segmented into separate AC and DC domains with alternating current capacitors placed in the AC domain near the die. This segmentation reduces the length and number of vias required for alternating current ripple mitigation, thereby reducing thermos-mechanical stress and improving reliability.
Solution Approach 2:
Different regions of the package are assigned different functional qualities: the DC domain contains DC capacitors optimized for voltage source coupling, while the AC domain contains AC capacitors optimized for die coupling. This local quality optimization allows each region to address specific issues (electromagnetic interference, alternating current ripple, thermos-mechanical weaknesses) without compromising overall reliability.
3Object-affected harmful factors
If a traditional power delivery network is used, then device complexity is low, but the ability to mitigate electromagnetic interference, alternating current ripple, and voltage drop is insufficient
Solution Approach 1:
The power delivery network is divided into distinct DC and AC domains separated by an interposer layer. Each domain contains specialized capacitors (DC capacitors near the voltage source, AC capacitors near the die) that address specific power delivery issues. This segmentation enables effective mitigation of electromagnetic interference, alternating current ripple, and voltage drop while maintaining manageable complexity through modular design.
Solution Approach 2:
The interposer layer serves as an intermediary structure that integrates both DC and AC domains. It contains through-substrate vias that provide low-inductance power delivery paths and houses AC capacitors that mitigate alternating current ripple. This intermediary structure consolidates multiple functions into a single component, reducing overall system complexity while improving power delivery performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces unwanted effects such as electromagnetic interference and voltage ripple, while allowing for fine-pitched, high-density interconnections, thereby enhancing the efficiency and reliability of power delivery in advanced electronic packages.
Implementation Method 1
a first capacitor, the first capacitor configured to deliver the direct current power to the die
Implementation Method 2
a second capacitor, the second capacitor configured to decouple alternating current interference from an output of a die
Implementation Method 3
an interposer layer disposed between the first core and the second core, configured to isolate the first core and the second core
Data Source
AI summary
An electronic device may include a printed circuit board. The electronic device may include a first core with a first cavity, the first core formed from an organic material, and the first cavity configured to house a DC capacitor for delivery of direct current to a die from a voltage source. The device may include a second core with a second cavity, the second core formed from an inorganic material and the second cavity configured to house an AC capacitor coupled to an output of the die for decoupling alternating current effects associated with the direct current. The device may include an interposer layer disposed between the first core and the second core, configured to isolate the first core and the second core.