Dual Cup Wheel Substrate Grinding with Dynamic Center Positioning
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Solution Overview
Problem
Existing substrate grinding devices face challenges in efficiently and accurately grinding large-sized substrates, particularly due to unground protrusions near the rotation center, which require finer abrasive grains, leading to increased wear and production costs.
Innovation Solution
A substrate grinding device with a work table that rotates and holds a substrate, featuring a cup wheel type first grinding wheel for rough grinding and a second grinding wheel for finish grinding, allowing the rotation center to be moved between their grinding ranges, enabling simultaneous contact and efficient processing without separate positions for rough and finish grinding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single grinding wheel is used for both rough and finish grinding, then device complexity is reduced, but manufacturing precision deteriorates due to unground protrusions near the rotation center
Solution Approach 1:
The grinding process is segmented into two distinct stages: rough grinding and finish grinding. Two separate grinding wheels are provided, each optimized for its specific function. The first grinding wheel (rough grinding wheel) has larger abrasive grains for rapid material removal, while the second grinding wheel (finish grinding wheel) has finer abrasive grains for high-precision surface finishing. This segmentation allows each wheel to perform its specialized function without compromise.
Solution Approach 2:
The work table is designed with dynamic positioning capability, allowing the rotation center of the substrate to be moved between different positions. During rough grinding, the rotation center is positioned at a first location within the grinding range of the first grinding wheel. During finish grinding, the rotation center is moved to a second location within the grinding range of the second grinding wheel. This dynamic repositioning enables the system to switch between rough and finish grinding operations using different wheels.
2Manufacturing precision
If finer abrasive grains are used near the rotation center, then manufacturing precision is improved, but loss of substance increases due to increased wear
Solution Approach 1:
Different regions of the substrate are processed with different wheel characteristics appropriate to the local requirements. The center region near the rotation center, which requires high precision, is processed by the finish grinding wheel with finer abrasive grains. The peripheral regions, which require rapid material removal, are processed by the rough grinding wheel with coarser abrasive grains. This local quality approach matches the grinding wheel characteristics to the specific processing requirements of different substrate regions.
Solution Approach 2:
The system dynamically switches between rough grinding and finish grinding operations. The work table moves the substrate rotation center to appropriate positions under each grinding wheel based on the processing stage. This dynamic operation allows the use of coarser grains during rough grinding (when wear is acceptable) and finer grains during finish grinding (when precision is critical), optimizing the balance between wear and precision.
3Manufacturing precision
If separate positions for rough and finish grinding are provided, then manufacturing precision is improved, but device complexity and loss of time increase
Solution Approach 1:
The rough grinding and finish grinding operations are merged into a single integrated work station. Both the first grinding wheel (rough grinding) and the second grinding wheel (finish grinding) are positioned above the same work table, allowing both operations to be performed without moving the substrate to different locations. The work table simply repositions the rotation center to different positions within the combined grinding range, enabling seamless transition between rough and finish grinding.
Solution Approach 2:
The rough grinding operation is performed as a preliminary action before finish grinding. The first grinding wheel rapidly removes material and prepares the substrate surface, creating a uniform baseline. This preliminary rough grinding eliminates warpage and major surface irregularities, allowing the subsequent finish grinding by the second wheel to focus solely on achieving high-precision surface finish, thereby reducing the total time required for precision grinding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient and accurate grinding of large-sized substrates by effectively utilizing both wheels, reducing wear and production costs by eliminating the need for frequent wheel replacements and minimizing grinding time.
Implementation Method 1
The work table is configured to rotate while sucking and holding a substrate
Implementation Method 2
The first grinding wheel and the second grinding wheel are cup wheel type wheels, and provided at positions where the first grinding wheel and the second grinding wheel can be simultaneously in contact with the substrate rotating, the first grinding wheel and the second grinding wheel being configured to grind the substrate rotating, while rotating
Data Source
AI summary
Provided is a substrate grinding device including: a work table; a first grinding wheel; and a second grinding wheel, wherein the work table is configured to rotate while sucking and holding a substrate, the first grinding wheel and the second grinding wheel are cup wheel type wheels, and provided at positions where the first grinding wheel and the second grinding wheel can be simultaneously in contact with the substrate rotating, the first grinding wheel and the second grinding wheel being configured to grind the substrate rotating, while rotating, and the work table is configured to be able to move a rotation center of the substrate from a first grinding position within a grinding range of the first grinding wheel to a second grinding position within a grinding range of the second grinding wheel.