Dual-Cure Resin CMP Pad via UV and Thermal Curing
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Solution Overview
Problem
Conventional chemical mechanical polishing (CMP) pads prepared by molding, casting, or extrusion-based processes lack desirable properties for effective CMP, such as being too brittle and suffering from non-uniform polishing rates, leading to over- or under-polishing issues.
Innovation Solution
A dual-cure resin is developed for preparing CMP pads using an additive manufacturing process, comprising acrylate-capped oligomers, acrylate monomers, photoinitiators, and thermal curatives, which undergo UV-initiated polymerization followed by thermal curing to form pads with controlled structures and improved mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional molding or casting processes are used to prepare CMP pads, then the manufacturing process is simple and straightforward, but the resulting pads are too brittle and exhibit non-uniform polishing rates
Solution Approach 1:
The patent applies parameter changes by transitioning from conventional thermal curing to UV-initiated photopolymerization curing. This fundamental parameter change in the curing mechanism enables the formation of CMP pads with superior mechanical properties and uniform polishing rates, while maintaining manufacturing simplicity through direct UV curing of the resin composition without complex post-processing steps
Solution Approach 2:
The patent utilizes composite materials by formulating a resin composition containing acrylate-capped oligomers, acrylate monomers, and photoinitiators. This composite resin system combines the advantages of different components to achieve both improved mechanical strength and ease of manufacture through UV-curable technology, resolving the contradiction between pad performance and manufacturing complexity
2Productivity
If UV-initiated photopolymerization is used to form CMP pads, then the pot life is extended and manufacturing throughput is increased, but the curing process requires precise control of UV irradiation parameters
Solution Approach 1:
The patent applies preliminary action by incorporating photoinitiators into the resin composition before manufacturing. These photoinitiators are pre-positioned to immediately activate upon UV exposure, enabling rapid curing and extended pot life. This preliminary preparation eliminates the need for complex real-time curing parameter adjustments during manufacturing, thereby increasing throughput while maintaining process simplicity
3Reliability
If conventional extrusion-based processes are used to prepare CMP pads, then the manufacturing process is continuous and efficient, but the pads lack desirable properties for effective CMP such as being too brittle
Solution Approach 1:
The patent applies mechanics substitution by replacing conventional mechanical extrusion-based processes with UV-initiated photopolymerization. This substitution eliminates the brittleness issue inherent in extrusion-formed pads while maintaining continuous manufacturing efficiency. The UV curing process enables rapid solidification of the resin composition without mechanical stress, producing reliable CMP pads with superior mechanical properties and uniform polishing performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual-cure resin achieves improved pot life, comparable removal rates, and planarization efficiencies while maintaining similar pad wear rates to conventional CMP pads, facilitating precise control over CMP processes and increased manufacturing throughput.
Implementation Method 1
Each layer of the plurality of layers may be formed via UV-initiated reaction of a precursor material to form a thin layer of solidified pad material
Implementation Method 2
comprising acrylate-capped oligomers, acrylate monomers, photoinitiators, and thermal curatives, which undergo UV-initiated polymerization followed by thermal curing
Data Source
AI summary
A dual-cure resin formulation having an improved pot life is described. The dual cure resin may be used to fabricate a CMP pad using a 3D printing process.