Dual-Curing Reaction Resin Composition for Chemical Fastening

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Solution Overview

Problem

Existing hybrid resin compositions based on free-radically curable and amine-curable compounds face challenges in storage stability and low-temperature curing, particularly when using peroxides as radical initiators, leading to insufficient curing and mechanical properties in chemical fastening applications.

Innovation Solution

A dual-curing reaction resin composition is developed, utilizing dialkyl peroxides as radical initiators, combined with a copper compound and a 1,3-dicarbonyl compound, and a reducing agent to create a storage-stable two-component system that cures effectively at room temperature, enhancing mechanical strength and adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If peroxides are used as radical initiators in hybrid resin compositions, then rapid curing is achieved, but storage stability deteriorates due to premature decomposition

Engineering Contradiction:
Improvecuring speedVSAvoidstorage stability
Core Design Contradiction:
SpeedVSStability of the object's composition

Solution Approach 1:

The patent changes the chemical structure parameter of the peroxide from conventional types to dialkyl peroxides (where R1 and R2 are alkyl groups with 4-16 carbon atoms). This structural modification lowers the decomposition temperature and activation energy, enabling the peroxide to remain stable during storage at room temperature but decompose readily at low curing temperatures (-10°C to +30°C), thus resolving the contradiction between storage stability and curing speed.

Inventive Principle:
Principle #35Parameter changes

2Speed

If conventional peroxide systems are used for cold hardening, then rapid curing at low temperatures is achieved, but mechanical strength deteriorates due to insufficient curing

Engineering Contradiction:
Improvecuring speed at low temperatureVSAvoidmechanical strength
Core Design Contradiction:
SpeedVSStrength

Solution Approach 1:

The patent creates a composite curing system combining dialkyl peroxides (for free-radical polymerization) with amine compounds (for polyaddition curing of epoxy groups). This dual-curing mechanism ensures that both polymerization reactions proceed effectively at low temperatures, producing a crosslinked network with superior mechanical strength and adhesion properties compared to single-curing systems.

Inventive Principle:
Principle #40Composite materials

3Adaptability or versatility

If hybrid binders with aliphatic amine and peroxide are used, then dual-curing capability is achieved, but low-temperature curing properties deteriorate

Engineering Contradiction:
Improvedual-curing capabilityVSAvoidlow-temperature curing performance
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent modifies the peroxide parameters by selecting dialkyl peroxides with specific alkyl group configurations (4-16 carbon atoms) that have optimal decomposition characteristics for low-temperature curing. This parameter optimization enables the peroxide to decompose and initiate free-radical polymerization effectively at temperatures as low as -10°C, while maintaining its ability to support dual-curing when combined with amine-hardened epoxy systems.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves reliable cold hardening and improved mechanical properties, ensuring effective curing and adhesion in chemical fastening applications, even at low temperatures, while maintaining storage stability.

Implementation Method 1

a hardener component (H) which contains at least one dialkyl peroxide (h-1) and at least one amine (h-2)... the compound (a-1) which can polymerize radically

Methodology Applied
Scientific EffectFree radical initiation: Photopolymerisation

Implementation Method 2

the hardener component (H) further contains an accelerator mixture (B) which contains a copper compound (b-1) and a 1,3-dicarbonyl compound (b-2)

Methodology Applied
Scientific EffectCatalysis: Catalysis

Implementation Method 3

with the proviso that the resin component (A) further contains a reducing agent (R) when the copper compound (b-1) is divalent or polyvalent

Methodology Applied
Scientific EffectReduction: Reduction

Implementation Method 4

compounds curable by a second reaction type different from the first reaction type, such as compounds which contain compounds polymerizable by polyaddition, for example epoxides

Methodology Applied
Scientific EffectPolyaddition: Chemical Bonding

Data Source

PatentEP2989061B1Reaction resin composition and its use
Publication Date: 2017.02.01 HILTI AG
  • EP2989061B1 patent drawing
  • EP2989061B1 patent drawing
  • EP2989061B1 patent drawing

AI summary

A reactive resin composition is described, comprising a resin constituent (A) comprising a free-radically polymerizable compound (a-1), a compound (a-2) which can react with an amine, and a bridging compound (a-3) having at least two reactive functionalities, one of which can free-radically (co)polymerize and one of which can react with an amine, and a hardener constituent (H) comprising at least one dialkyl peroxide (h-1) and at least one amine (h-2), where the resin constituent (A) and the hardener constituent (H) or the resin constituent (A) and the at least one dialkyl peroxide (h-1) and the at least one amine (h-2) of the hardener constituent (H) are spatially separated from one another, in order to prevent reaction prior to mixing of these components, which is characterized in that the hardener constituent (H) further comprises an accelerator mixture (B) consisting of a copper compound (b-1) and a 1,3-dicarbonyl compound (b-2), with the proviso that the resin constituent (A) further comprises a reducing agent (R) when the copper compound (b-1) is di- or polyvalent. The reactive resin composition is suitable for use for construction purposes, preferably for securing anchor thread bars, iron reinforcements, bushings or screws in boreholes in all kinds of substrata.