Dual-Edge Substrate Wiring to Minimize Micro-LED Panel Seams
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Solution Overview
Problem
Micro-LED display panels face issues with metal wire expansion and fall-off due to thermal expansion coefficient differences between metal and glass substrates, and flexible printed circuits (FPC) cause seams when splicing multiple panels, affecting display quality and appearance.
Innovation Solution
A substrate with a driving backplane featuring first and second connecting lines on opposite surfaces, connected via lap joints and a protective layer, eliminating the need for through holes and reducing seam thickness in spliced displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal wires are used to connect leads on glass substrate surfaces, then electrical connection is achieved, but metal wires expand and fall off due to thermal expansion coefficient differences between metal and glass
Solution Approach 1:
The patent introduces an intermediary structure (the groove and connecting line configuration) between the metal wire and glass substrate. The groove embeds the metal wire, providing mechanical support and constraint, while the connecting lines bridge the thermal expansion differences. This intermediary structure prevents direct thermal stress transmission that causes wire fall-off.
Solution Approach 2:
The patent changes the physical parameters of the connection structure by creating grooves with specific dimensions and depths in the glass substrate. The groove dimensions are optimized to provide adequate mechanical support for the metal wire while maintaining electrical connection reliability. The groove depth and width parameters are specifically designed to constrain wire movement during thermal cycling.
2Reliability
If flexible printed circuits (FPC) are used to connect leads, then electrical connection is achieved, but seams appear when splicing multiple panels, affecting display quality and appearance
Solution Approach 1:
The patent extracts and eliminates the FPC component from the system by implementing direct electrical connection through the glass substrate using groove-embedded metal wires and connecting lines. This removal of the FPC intermediary eliminates the seam formation issue that occurs when splicing multiple display panels, as the connection is now integrated into the substrate itself rather than being a separate flexible circuit layer.
3Reliability
If through holes are used to connect leads across the substrate, then electrical connection is achieved, but mechanical properties of the substrate are reduced
Solution Approach 1:
The patent transitions from a three-dimensional through-hole penetration approach to a surface-level groove configuration. Instead of creating holes that pass completely through the substrate thickness, the grooves are formed only in the surface region where lead groups are located. This dimensional change confines the structural modification to the necessary minimum depth, preserving the bulk mechanical properties of the substrate while achieving the electrical connection function.
Data Source
AI summary
A substrate includes a driving backplane, a plurality of first connecting lines and a plurality of second connecting lines. The driving backplane includes a base substrate, at least one first lead group and at least one second lead group. Each first lead group includes a plurality of first leads, and each second lead group includes a plurality of second leads. A first lead group and a corresponding second lead group is disposed in a peripheral region. The plurality of first connecting lines are disposed on at least one side face of the driving backplane, each first connecting line is electrically connected to at least one first lead. The plurality of second connecting lines are disposed on the at least one side face of the driving backplane, each second connecting line is electrically connected to at least one second lead, and is in contact with a corresponding first connecting line.