Dual End Effector Variable Pitch for Multi-Chamber Wafer Transfer
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Solution Overview
Problem
In semiconductor electronic device manufacturing, existing robot apparatuses with fixed end effector pitch struggle to efficiently access dual processing locations with different separation distances, leading to throughput deficiencies in substrate processing systems that combine multiple processes like CVD/ALD and PVD.
Innovation Solution
A robot apparatus with variable end effector pitch is designed, featuring an upper arm, forearm, and wrist members that rotate about multiple axes to adjust the distance between dual end effectors, allowing them to match both the opening distance of transfer chamber slit valves and the processing distance of processing locations, enabling simultaneous access and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a robot apparatus uses fixed end effector pitch, then the structure is simple and easy to manufacture, but it cannot efficiently access dual processing locations with different separation distances
Solution Approach 1:
The robot apparatus employs a variable pitch mechanism that dynamically adjusts the distance between the first and second end effectors. The pitch can be changed from a first pitch (when end effectors are closer to the rotational axis) to a second pitch (when end effectors are extended further), allowing the robot to adapt to different separation distances of dual processing locations in different chambers, thereby resolving the contradiction between adaptability and structural simplicity.
2Productivity
If a robot apparatus uses fixed end effector pitch, then the device complexity is low, but the throughput is insufficient for substrate processing systems combining multiple processes
Solution Approach 1:
The variable pitch mechanism enables the robot to optimize its configuration for different processing scenarios. By adjusting the pitch dynamically, the robot can efficiently handle substrates in chambers with different dual processing location separations, thereby improving overall substrate processing throughput without requiring multiple fixed-pitch robots, thus balancing productivity improvement with acceptable device complexity.
3Adaptability or versatility
If the robot uses variable pitch mechanism, then it can accommodate different processing chamber configurations, but the device complexity increases
Solution Approach 1:
The variable pitch mechanism is implemented through a controlled movement system that adjusts the relative position of the first and second end effectors along the arm. This dynamic adjustment capability allows the robot to accommodate different processing chamber configurations with varying dual opening separations, while the mechanism is designed to maintain reasonable complexity through integrated control systems.
Solution Approach 2:
The variable pitch mechanism enables a single robot apparatus to perform multiple functions by adapting to different chamber configurations. Instead of requiring separate robots for different pitch requirements, this universal design allows one robot to serve multiple processing chambers with different dual processing location separations, improving versatility while managing overall system complexity.
Data Source
AI summary
A robot apparatus may include an upper arm adapted to rotate about a first rotational axis and a forearm rotatably coupled to the upper arm at a second rotational axis. A first wrist member may be rotatably coupled to the forearm at a third rotation axis. A second wrist member may be rotatably coupled to the forearm at the third rotation axis. A first end effector may be coupled to the first wrist member and a second end effector may be coupled to the second wrist member. The first wrist member and the second wrist member may be configured to rotate about the third rotational axis between a first pitch and a second pitch as a function of extension of the robot apparatus. Other apparatus and methods are disclosed.