Dual-Embedded Microstrip Interconnects for Crosstalk Cancellation

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Solution Overview

Problem

High-density interconnects face challenges with increased crosstalk noise due to closer component placement, leading to degraded signal integrity and reduced system performance, as conventional microstrip routing methods struggle to maintain signal quality at higher routing densities.

Innovation Solution

The implementation of dual-embedded microstrip interconnects with a reference layer and dielectric separation allows for closer conductor placement by using a third conductor above or below a pair of conductors, enabling crosstalk cancellation and higher routing density without increasing noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conductors are placed closer together to increase routing density, then routing density is improved, but crosstalk noise increases and signal integrity deteriorates

Engineering Contradiction:

Improverouting densityVSAvoidcrosstalk noise

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a third conductor that generates electromagnetic fields to actively cancel the crosstalk noise produced by adjacent conductors. The harmful electromagnetic interference is converted into a beneficial cancellation effect by using the third conductor to produce opposing fields that neutralize the noise, allowing high routing density to be maintained without signal integrity degradation

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The third conductor acts as an intermediary element between the pair of conductors. It mediates the electromagnetic interaction by generating fields that counterbalance the crosstalk, serving as an active noise cancellation mechanism that enables closer conductor placement while maintaining signal quality

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of stationary object

If conventional microstrip routing is used with closer component placement, then area is reduced, but signal integrity is degraded due to increased crosstalk

Engineering Contradiction:

Improvecircuit board areaVSAvoidsignal integrity

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The third conductor converts the harmful crosstalk effect into a beneficial cancellation mechanism. By generating electromagnetic fields that oppose the crosstalk noise, it enables smaller circuit board area while maintaining signal integrity that would otherwise be lost at higher routing densities

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If conductors are offset to reduce crosstalk, then signal integrity is improved, but routing density decreases and area increases

Engineering Contradiction:

Improvesignal integrityVSAvoidrouting density

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

Instead of passively avoiding crosstalk through offsetting, the invention actively converts the crosstalk harm into a beneficial effect by using the third conductor to generate cancellation fields. This allows conductors to be placed closer together at high routing density while maintaining signal integrity through active noise cancellation rather than passive separation

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces crosstalk noise, allowing for higher routing density while maintaining signal integrity, even at increased component proximity, by canceling out electromagnetic interference between conductors.

Implementation Method 1

By having a third conductor disposed above or below a pair of conductors, crosstalk cancelation may occur. Crosstalk cancellation may allow the pair of conductors to be disposed closer to each other in the DEM configuration than in a single-layer configuration.

Methodology Applied

Scientific EffectCrosstalk cancellation: Electromagnetic Induction

Data Source

PatentUS11395402B2High-density dual-embedded microstrip interconnects

Publication Date: 2022.07.19 INTEL CORP

AI summary

In accordance with embodiments disclosed herein, there is provided a high-density dual-embedded-microstrip interconnect. An interconnect includes a reference layer and a dielectric disposed on the reference layer. The interconnect further includes a pair of conductors including a first conductor and a second conductor that are in an edge-facing orientation. The interconnect further includes a third conductor. The pair of conductors may be disposed within the dielectric and the third conductor may be disposed on the dielectric above the pair of conductors. The pair of conductors may be disposed on the dielectric and the third conductor may be disposed within the dielectric below the pair of conductors. First noise received by the third conductor from the first conductor and second noise received by the third conductor from the second conductor at least partially cancel out.