Dual-Emission LED Phosphor Package for Soft White and Near-IR Output
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Solution Overview
Problem
Current near-infrared LED devices face challenges with low luminous power and difficulty in adjusting white light emission, leading to red-light bursts and high packaging costs due to complex processes and expensive infrared chips.
Innovation Solution
An optical device combining a blue-light LED chip with a visible-light luminescent material and a near-infrared luminescent material, which emits near-infrared and visible light simultaneously, simplifying packaging, reducing costs, and allowing control over white-light emission to eliminate red-light bursts and achieve a soft visual effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple infrared chips are used to improve near-infrared luminous power, then the luminous power increases, but the packaging complexity and cost increase significantly
Solution Approach 1:
The patent combines multiple luminescent materials (near-infrared luminescent material and red luminescent material) into a single phosphor layer that can be packaged with one LED chip. This merging approach achieves the effect of multiple infrared chips while simplifying the packaging process to a single chip package, thereby reducing packaging complexity while maintaining high near-infrared luminous power.
Solution Approach 2:
The patent uses composite luminescent materials including near-infrared luminescent material (such as Y3Al5O12:Cr3+) and red luminescent material (such as CaAlSiN3:Eu2+) in specific ratios. This composite material approach enables simultaneous emission of near-infrared and red light from a single package, achieving high near-infrared luminous power without the need for multiple separate infrared chips.
2Illumination intensity
If white-light LEDs are added to compensate for light in low light conditions, then the lighting performance improves, but the drive current difference affects the service life of the device
Solution Approach 1:
The patent makes the single LED chip package serve multiple functions: it emits blue light directly, excites red luminescent material to produce red light, and excites near-infrared luminescent material to produce near-infrared light. This multi-functionality eliminates the need for separate white-light LEDs, ensuring uniform drive current and extending device service life while maintaining good lighting performance.
Solution Approach 2:
The patent merges the functions of blue LED chip and white-light compensation LEDs into a single integrated package. By combining red luminescent material and near-infrared luminescent material in the same package, the system achieves both illumination and near-infrared emission functions simultaneously with a single drive current, improving reliability.
3Ease of manufacture
If near-infrared luminescent material is used with LED chip to simplify packaging, then packaging cost decreases, but the luminous power of near-infrared light needs to be improved
Solution Approach 1:
The patent optimizes parameters including the ratio of near-infrared luminescent material to red luminescent material (specifically 95:5 to 99:1), the particle size distribution of luminescent materials (D10, D50, D90 values), and the thickness of the phosphor layer. These parameter changes maximize the near-infrared luminous power output while maintaining the simplified single-package structure, achieving both low packaging cost and high luminous power.
Solution Approach 2:
The patent employs composite luminescent materials with specific compositions and ratios to enhance near-infrared luminous power within the simplified packaging structure. The composite approach allows efficient energy transfer from the blue LED chip to both red and near-infrared luminescent materials, achieving high near-infrared power output without complex multi-chip packaging.
4Object-affected harmful factors
If the luminous power of white light is increased to eliminate red-light bursts, then the red-light bursts are reduced, but the visual effect becomes harsh and the white light control becomes difficult
Solution Approach 1:
The patent precisely controls the ratio of near-infrared luminescent material to red luminescent material (95:5 to 99:1) and adjusts the drive current parameters to achieve optimal performance. This parameter optimization eliminates red-light bursts by suppressing excessive red light emission while maintaining comfortable visual effects through balanced spectral distribution, avoiding the harshness associated with high white light intensity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical device achieves high luminous efficiency, eliminates red-light bursts, and provides adjustable white-light emission, enhancing its application in security monitoring and other fields with improved reliability and anti-jamming capabilities.
Implementation Method 1
an LED chip, a visible-light luminescent material, and a near-infrared luminescent material
Implementation Method 2
under the excitation of the LED chip
Data Source
AI summary
An optical device includes an LED chip, a visible-light luminescent material, and a near-infrared luminescent material, wherein a luminous power of light emitted by the near-infrared and visible-light luminescent materials in a band of 650-1000 nm under the excitation of the LED chip is A, and a sum of a luminous power of light emitted by the near-infrared and visible-light luminescent materials in a band of 350-650 nm under the excitation of the LED chip and a luminous power of residual light emitted by the LED chip in the band of 350-650 nm after the LED chip excites the near-infrared and visible-light luminescent materials is B, with B/A*100% being 0.1%-10%. According to the implementation where the optical device employs the LED chip to combine the near-infrared luminescent material and the visible-light luminescent material simultaneously.
