Dual Encapsulant Semiconductor Package for Reflow Stability
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Solution Overview
Problem
The Package on Package (PoP) technique faces challenges in maintaining reliable electrical connections and preventing substrate tilting during the reflow process, which affects the structural integrity and reliability of semiconductor device packages.
Innovation Solution
The semiconductor device package employs a dual encapsulant structure with different materials and sizes for the encapsulants, and a shielding layer to protect electrical contacts and provide structural support, ensuring reliable connections and preventing substrate tilting during reflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single encapsulant structure is used in PoP, then the device complexity is reduced, but the reliability of electrical connections deteriorates and substrate tilting occurs during reflow
Solution Approach 1:
The encapsulant structure is divided into multiple segments: a first encapsulant material filling a first cavity and a second encapsulant material filling a second cavity. This segmentation allows each encapsulant to be optimized for specific functions, with the first encapsulant providing structural support and the second encapsulant ensuring reliable electrical connections, thereby resolving the contradiction between reliability and complexity.
Solution Approach 2:
Different regions of the encapsulant structure are assigned different materials with specific properties. The first encapsulant material is selected for structural support characteristics, while the second encapsulant material is selected for electrical connection reliability. This local differentiation of material quality enables each region to perform its specific function optimally without requiring complex overall restructuring.
2Reliability
If a dual encapsulant structure with different materials is used, then the reliability of electrical connections is improved, but the manufacturing complexity increases
Solution Approach 1:
The first encapsulant material is applied and cured before the second encapsulant material is applied. This preliminary action allows the first encapsulant to establish the structural framework and support characteristics first, creating a stable base for subsequent application of the second encapsulant material, thereby simplifying the overall manufacturing process despite using multiple materials.
Solution Approach 2:
The first encapsulant material acts as an intermediary layer between the substrates and the second encapsulant material. This intermediary structure provides the necessary structural support and creates appropriate interfaces for the second encapsulant to ensure reliable electrical connections, facilitating the manufacturing process by establishing a clear sequence of operations.
3Strength
If the encapsulant cavity is completely filled, then the structural support is maximized, but the electrical connection reliability deteriorates due to substrate tilting
Solution Approach 1:
The encapsulant cavity is segmented into a first cavity and a second cavity, each filled with different encapsulant materials. The first cavity is filled to provide structural support, while the second cavity is filled to ensure reliable electrical connections. This segmentation resolves the contradiction by allowing each segment to optimize for its specific function rather than requiring complete filling with a single material.
Solution Approach 2:
Different fill levels and material properties are applied to different regions of the encapsulant cavity. The first encapsulant material is applied with properties optimized for structural support, while the second encapsulant material is applied with properties optimized for electrical connection reliability. This local differentiation of quality allows the structure to simultaneously achieve both structural strength and electrical connection reliability.
Data Source
AI summary
The present disclosure provides a semiconductor device package. The semiconductor device package includes a first substrate and a second substrate. The first substrate has a first surface and a second surface opposite to the first surface of the first substrate. The second substrate has a first surface facing the first substrate and a second surface opposite to the first surface of the second substrate. The semiconductor device package also includes a first electronic component disposed on the first surface of the second substrate and electrically connected to the first surface of the second substrate. The semiconductor device package also includes a first encapsulant and a second encapsulant between the first substrate and the second substrate. The first encapsulant is different from the second encapsulant. A method of manufacturing a semiconductor device package is also disclosed.