Dual-Encapsulation Optoelectronic Module With Air-Gap Optical Assembly

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Solution Overview

Problem

Molded-in lenses in optoelectronic modules have limited functionality, material limitations, and lack an air-gap for complex optical performance, leading to suboptimal design tradeoffs between optical and mechanical properties.

Innovation Solution

The optoelectronic module features dual encapsulation with transparent and opaque layers, allowing for separate optical channels with an air-gap and enabling complex optical assemblies, including multiple lenses, using materials like glass for improved optical performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If molded-in lenses are used in the clear overmold, then the module structure is simplified and mechanical stability is enhanced, but the optical functionality is limited and material selection is constrained

Engineering Contradiction:
Improvemodule structureVSAvoidoptical functionality
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent divides the optical system into separate components: the clear overmold provides structural support and basic encapsulation, while a distinct optical assembly containing complex lenses is positioned within an opening in the overmold. This segmentation allows each component to be optimized independently - the overmold for mechanical properties and the optical assembly for advanced optical functions including focusing and pattern generation

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent extracts the optical lens functions from the clear overmold material itself and places them in a separate optical assembly that is positioned within an opening in the overmold. This extraction enables the use of specialized optical materials and complex lens configurations that would be impossible to integrate directly into the molded overmold structure

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If glass is used for lenses to achieve ideal optical properties, then transmission and refractive index are optimized, but the clear overmold cannot be constructed from glass due to mechanical property requirements

Engineering Contradiction:
Improveoptical propertiesVSAvoidovermold construction
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent segments the optical material requirements from the structural material requirements. The clear overmold is manufactured from polymer materials suitable for injection molding and mechanical durability, while the optical assembly uses glass or other specialized optical materials to achieve ideal transmission and refractive index properties. Each material is selected and manufactured according to its optimal properties

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent creates a composite structure where the clear overmold (polymer material) and the optical assembly (glass or specialized optical material) work together as an integrated system. The overmold provides mechanical support and environmental protection, while the optical assembly provides superior optical performance, combining the advantages of different material classes

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If a single clear overmold material is used for both structural support and lens formation, then manufacturing is simplified, but design tradeoffs between mechanical and optical properties occur

Engineering Contradiction:
Improvemanufacturing processVSAvoiddesign flexibility
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent separates the structural encapsulation function from the optical lens function. The clear overmold is manufactured using standard injection molding processes for structural support, while the optical assembly is separately manufactured and then integrated into an opening in the overmold. This segmentation maintains manufacturing efficiency while dramatically increasing design flexibility for optical configurations

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent adds a new dimensional aspect to the design by introducing a separate optical assembly that can be positioned within an opening in the overmold. This creates a multi-layered structure where the optical components are separated from the structural components, enabling independent optimization of both manufacturing processes and design parameters

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Stability of the object's composition

If molded-in lenses are used, then the lens is integrated with the overmold, but no air-gap can be provided between the lens and the underlying active optical component

Engineering Contradiction:
Improvelens integrationVSAvoidoptical performance
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent segments the lens from the overmold structure by positioning the optical assembly within an opening rather than molding it directly into the overmold. This segmentation creates the necessary air-gap between the optical components and the active elements while maintaining secure mechanical integration through the opening structure

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an air-gap as an intermediary space between the optical assembly and the active optical components. This air-gap acts as a mediator that enables the optical assembly to perform focusing and pattern generation functions effectively, while the optical assembly itself serves as an intermediary structure that bridges the gap between the overmold and the active components

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentEP3417486B1Optoelectronic module having dual encapsulation with opening for receiving an optical assembly
Publication Date: 2025.09.24 AMS OSRAM ASIA PACIFIC PTE LTD
  • EP3417486B1 patent drawingFigure 1
  • EP3417486B1 patent drawingFigure 2
  • EP3417486B1 patent drawingFigure 3A~3B

AI summary

An optoelectronic module includes first and second optical channels having respective active optoelectronic components. A transparent encapsulation is over the active optoelectronic components, and opaque encapsulation is on the transparent encapsulation. The opaque encapsulation has a first opening over a first active optoelectronic component and a second opening over a second optoelectronic component. The opaque encapsulation forms a ledge in an area of the second opening, and an optical assembly is disposed on the ledge within the second opening over the second optoelectronic component.