Dual End-Effector Transfer Robot with Buffer Mechanism
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Solution Overview
Problem
Conventional single-wafer-processing type semiconductor-processing apparatuses face challenges with increased costs, footprint, and reduced throughput due to the need for multiple reactors and complex wafer transferring mechanisms with double arms, which also lead to limitations in air evacuation and pressure restoration times.
Innovation Solution
A substrate-processing apparatus with a vacuum load-lock system featuring a load-lock chamber with dual compartments and a transferring robot equipped with dual end-effectors that can transfer two substrates simultaneously, utilizing a buffer mechanism within the reaction chamber to enhance throughput and reduce the load-lock chamber size, while maintaining a single arm configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of reactors is increased to increase productivity in a single-wafer-processing type apparatus, then productivity is improved, but the footprint and faceprint increase and costs run up
Solution Approach 1:
The patent transitions from a planar radial arrangement of reactors around a polygonal transfer chamber to a three-dimensional configuration where multiple reaction chambers are stacked vertically and connected to a single load-lock chamber. This vertical stacking enables multiple reactors to share a common load-lock, thereby increasing productivity without proportionally increasing the footprint area.
2Adaptability or versatility
If the load-lock chamber capacity is increased to accommodate double arms for wafer transferring, then the wafer transferring capability is improved, but the time required for evacuating air and restoring atmospheric pressure is lengthened
Solution Approach 1:
The load-lock chamber is divided into two separate compartments, each capable of independently accommodating a wafer. This segmentation allows the system to perform wafer transfer operations in one compartment while the other compartment undergoes evacuation or pressure restoration, thereby maintaining transfer capability without increasing the total chamber volume or time requirements.
3Device complexity
If a common polygonal transfer room is used with radially attached reactors, then the apparatus structure is simplified, but the footprint increases and throughput decreases when apparatus breakdown or maintenance occurs
Solution Approach 1:
Multiple reaction chambers are merged to share a single load-lock chamber, creating a modular architecture where reactors can be independently maintained or replaced without affecting the entire system. This consolidation reduces the overall apparatus footprint while maintaining throughput through parallel processing capabilities.
4Productivity
If double arms are equipped on the wafer transferring mechanism to keep next wafer standing by in load-lock chamber, then the wafer transfer efficiency is improved, but the transferring mechanism complexifies and costs run up
Solution Approach 1:
A buffer mechanism is introduced as an intermediary component within the reaction chamber to temporarily hold wafers. This buffer acts as a mediator that enables continuous wafer transfer operations without requiring complex double-arm mechanisms, thereby maintaining transfer efficiency while simplifying the overall transferring mechanism design.
Data Source
AI summary
A substrate transfer apparatus for loading and unloading substrates in a reaction chamber, includes: an arm having a distal end which is laterally movable in a straight line direction; and end-effectors for loading and unloading substrates in a reaction chamber, which include a lower end-effector and an upper end-effector. One of the lower end-effector or the upper end-effector is movably coupled to the arm at a distal end of the arm, and the other end-effector is fixed to the movably coupled end-effector. The fixed end-effector is fixed to the movably coupled end-effector.