Dual-Epoxy Resin Composition for Thermal Expansion Mismatch
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Solution Overview
Problem
Current epoxy resin bonding agents face challenges in providing both high flexibility and adhesion properties, especially when dealing with thermal expansion differences between materials like aluminum and fiber-reinforced resins, and silicon chips and metals, leading to issues such as warpage and interfacial stress.
Innovation Solution
A resin composition incorporating two specific epoxy compounds with distinct structures, one having a long alkyl chain and the other with a low epoxy equivalent, which together produce a cured product that exhibits elastic deformation and high adhesion, effectively addressing thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible epoxy compounds with high molecular weight are used to achieve plastic deformation and flexibility, then the cured product can follow expansion differences, but the whole structure loses rigidity and durability
Solution Approach 1:
The patent uses a composite epoxy system combining two distinct epoxy compounds: Compound A (epoxy equivalent 500-10,000 g/eq) providing flexibility and elastic deformation through its molecular structure, and Compound B (epoxy equivalent 100-300 g/eq) providing rigidity and strength. This composite approach allows the cured product to simultaneously achieve both adaptability to thermal expansion and structural rigidity, resolving the contradiction between flexibility and strength
2Adaptability or versatility
If epoxy compounds with low glass transition temperature are used to achieve high elongation and elastic deformation, then flexibility is improved, but adhesion force is markedly reduced in high temperature regions
Solution Approach 1:
The patent carefully controls the glass transition temperature (Tg) of the cured product to be 50-150°C through selecting appropriate epoxy compounds and their ratios. This parameter optimization ensures the cured product maintains both elastic deformation capability (flexibility) and adequate adhesion force across a wide temperature range including high temperature regions, resolving the contradiction between elongation and high-temperature adhesion
3Strength
If epoxy resins with high glass transition temperature are used to maintain adhesion force at high temperature, then temperature dependency is reduced, but flexibility and stress relaxation function are lost
Solution Approach 1:
The patent optimizes the glass transition temperature to a moderate range (50-150°C) rather than using high Tg materials. This parameter selection balances the competing requirements: the cured product retains sufficient flexibility and stress relaxation capability while maintaining stable adhesion force across the operating temperature range, including high temperature conditions
4Stability of the object's composition
If conventional epoxy resin is used to achieve dimensional stability and chemical resistance, then structural integrity is maintained, but the cured product becomes hard and brittle with poor adhesion
Solution Approach 1:
The patent employs a composite system of two epoxy compounds with different molecular characteristics. Compound A (higher epoxy equivalent) provides flexibility and adhesion, while Compound B (lower epoxy equivalent) contributes to crosslinking density and dimensional stability. The synergistic combination maintains structural integrity and chemical resistance while preventing brittleness and improving adhesion properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a flexible cured product with high elongation and adhesion properties across a wide temperature range, reducing warpage and interfacial stress, and maintaining mechanical integrity under thermal expansion variations.
Implementation Method 1
an epoxy compound A having a structure of the general formula (1) below and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq... produces a flexible cured product which has both high elongation such that the cured product undergoes elastic deformation
Data Source
AI summary
The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.