Dual Exothermic Peak Adhesive for Semiconductor Packaging
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Solution Overview
Problem
Existing adhesive compositions for semiconductors fail to efficiently manage curing processes, leading to void formation and increased processing time due to high flowability and the need for separate semi-curing and post-molding cure (PMC) processes, which affect the reliability and productivity of semiconductor packaging.
Innovation Solution
An adhesive composition with two distinct exothermic peaks, one at a lower temperature for initial curing and another at a higher temperature for residual curing, utilizing a combination of phenolic and amine curing agents with a phosphorus-containing catalyst, along with a silane coupling agent and fillers, to achieve independent curing zones, reducing void formation and eliminating the need for semi-curing and PMC processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single exothermic peak is used for curing, then the curing process is simple, but void formation increases and processing time increases due to high flowability
Solution Approach 1:
The curing process is segmented into two distinct exothermic peaks: a first exothermic peak (65-185°C) for initial curing and a second exothermic peak (155-350°C) for residual curing. This segmentation allows different curing stages to occur at different temperature zones, preventing void formation while maintaining process simplicity.
Solution Approach 2:
Different regions of the adhesive composition are activated at different temperature zones. The first exothermic peak activates at lower temperatures for initial bonding, while the second exothermic peak activates at higher temperatures for complete curing. This local quality approach ensures proper curing without excessive flowability that causes voids.
2Reliability
If separate semi-curing and post-molding cure processes are used, then curing completeness is improved, but processing time increases
Solution Approach 1:
The semi-curing and post-molding cure processes are merged into a single curing cycle through the dual exothermic peak design. The first exothermic peak provides initial curing during semi-curing, while the second exothermic peak provides residual curing during post-molding, eliminating the need for separate process steps and reducing total processing time.
Solution Approach 2:
The first exothermic peak performs preliminary curing action at lower temperatures during the semi-curing stage, establishing initial bonds before the second exothermic peak activates for complete curing. This preliminary action allows the adhesive to set partially without requiring extended processing time.
3Ease of operation
If high flowability is used in the adhesive, then ease of application is improved, but void formation increases
Solution Approach 1:
The adhesive composition exhibits dynamic viscosity control through temperature-dependent curing. At lower temperatures during application, the adhesive maintains sufficient flowability for ease of application. As temperature increases during curing, the first exothermic peak activates to reduce flowability and prevent void formation, while the second exothermic peak completes the curing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition achieves a void proportion of less than 15% after one cycle, enhancing the reliability and efficiency of semiconductor packaging by allowing separate and efficient curing zones, thereby reducing processing time and improving adhesion properties.
Implementation Method 1
The adhesive composition may include a thermoplastic resin, an epoxy resin, curing agents, the curing agents including two kinds of curing agents activated in different reaction temperature zones, and a curing catalyst
Data Source
AI summary
An adhesive composition for semiconductors, an adhesive film prepared using the adhesive composition, and a semiconductor device including the adhesive film, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein a first exothermic peak appears at a lower temperature than a second exothermic peak, and the adhesive composition has a curing rate of about 70% to 100% in a first exothermic peak zone, as calculated by Equation 1:Curing rate=[(Heating value upon 0 cycle−Heating value after 1 cycle)/Heating value upon 0 cycle]×100.