Timepiece Manufacturing With Dual-Face Oxidation for Wafer Flatness
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Solution Overview
Problem
Existing methods for manufacturing watch parts from silicon wafers result in deformations due to stress-induced flatness issues and require complex, lengthy processes with potential damage risks.
Innovation Solution
A method involving simultaneous thermal oxidation of both faces of a silicon wafer to balance stresses and deformations, using a vertical suspension and controlled handling to simplify the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an initial oxide layer is formed on one face of the silicon wafer, then the wafer can be used for manufacturing watch parts, but stresses induced by oxide formation generate deformations degrading flatness
Solution Approach 1:
The patent applies asymmetry by forming oxide layers on both faces of the wafer rather than just one, creating a symmetric stress distribution pattern that compensates for deformation. This dual-face oxidation approach balances the asymmetric stress concentration that occurs with single-face oxidation, thereby maintaining wafer flatness while still enabling manufacturing.
Solution Approach 2:
The patent implements preliminary anti-action by pre-forming oxide layers on both faces of the wafer before manufacturing operations. This preliminary oxidation creates a protective oxide layer on each face that prevents subsequent stress-induced deformations, effectively countering the harmful effect of stress concentration before it can degrade wafer flatness.
2Ease of manufacture
If special handling operations are used to form initial oxide layer, then oxide layer can be formed, but the process becomes complex and lengthy with risks of damage
Solution Approach 1:
The patent merges the oxide layer formation operations into a single integrated process step where both faces of the wafer are oxidized simultaneously. This consolidation eliminates the need for separate handling operations for each face, reducing process complexity and duration while maintaining the protective oxide layer formation.
Solution Approach 2:
The patent applies universality by using a single oxidation process that serves multiple functions: it forms protective oxide layers on both faces simultaneously, balances stresses to maintain flatness, and eliminates the need for separate handling operations. This multi-functional approach simplifies the overall manufacturing process while achieving multiple objectives.
3Manufacturing precision
If oxide layer is formed on both faces of the base plate, then stresses and deformations are balanced, but the process requires simultaneous oxidation of upper and lower faces
Solution Approach 1:
The patent applies dimensionality change by transitioning from a single-face oxidation approach to a dual-face oxidation approach, adding the temporal and spatial dimension of simultaneous processing. This dimensional expansion allows both faces to be oxidized at the same time, achieving stress balance without requiring complex sequential operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces stress and deformation risks while simplifying the manufacturing process, ensuring high-quality production of watch parts with balanced stress distribution.
Implementation Method 1
forming by thermal oxidation an oxide layer on the upper face and on the lower face of the base plate
Data Source
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AI summary
The invention relates to a method for manufacturing at least one timepiece (90) from a base plate (10), comprising the steps of: - providing the base plate (10), formed from a homogeneous base material with a thickness at least substantially equal to a maximum thickness of the timepiece (90) and having an upper face and a lower face, - forming by thermal oxidation an oxide layer on the upper face and on the lower face of the base plate (10), the oxide layer formed limiting the stresses and/or deformations within the plate, - forming the timepiece (90) by a photolithography technique - etching the oxidized upper face, - releasing the timepiece (90).