Dual-Face Phased-Array Transceiver for High-Frequency Signal Coverage
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Solution Overview
Problem
Wireless communication networks face challenges in providing uniform coverage, especially in non-line-of-sight environments and structures, due to high-frequency signal attenuation by atmospheric gases and building materials, which limits the effectiveness of existing transceivers in urban and indoor settings.
Innovation Solution
A wireless transceiver with a planar substrate and phased arrays of antennae on opposite faces, connected via vias for signal transmission, allowing directional and controllable orientation to enhance signal reception and retransmission, particularly suited for frequencies above 5 GHz, and integrated into transparent materials like glass for aesthetic and functional purposes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If wireless communication networks move to higher frequencies (above 5 GHz) to improve data rates, then data transmission speed is improved, but signal coverage and penetration capability deteriorate due to increased attenuation by atmospheric gases and building materials
Solution Approach 1:
The system divides the coverage area into multiple zones using distributed transceivers integrated into building structures. Each transceiver handles a localized segment, relaying signals to overcome the limited range of high-frequency waves while maintaining overall network coverage and reliability.
Solution Approach 2:
Building-integrated transceivers act as intermediary relay nodes between external base stations and internal wireless devices. These intermediaries receive high-frequency signals from outside, amplify and process them, then retransmit them internally, compensating for signal attenuation by atmospheric gases and building materials.
2Reliability
If transceivers are integrated into building structures (e.g., window glass) to improve signal penetration and coverage, then signal coverage is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The transceiver units are designed with multi-functionality, serving both as structural components (integrated into building elements like glass) and as wireless communication nodes. This universal design reduces overall system complexity by combining multiple functions into single integrated units rather than separate components.
Solution Approach 2:
The transceiver is integrated into thin film or glass structures using flexible substrate technologies. This approach allows the communication device to be embedded within building materials without significantly altering their structural properties, simplifying integration while maintaining signal coverage benefits.
3Shape
If transceivers are integrated into transparent materials like glass for aesthetic purposes, then visual appearance is improved, but manufacturing precision and assembly difficulty increase
Solution Approach 1:
The transceiver is fabricated on flexible thin film substrates that can be conformally applied to glass surfaces. This technique maintains the transparency and aesthetic appearance of the glass while providing a straightforward integration method that reduces manufacturing precision requirements compared to rigid embedded structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved signal coverage and reduced power consumption by orienting antennae for optimal signal directionality, reducing interference and enhancing transparency for integration into building structures, thus addressing the limitations of existing transceivers in high-frequency wireless networks.
Implementation Method 1
The circuit is configured to control the first antennae as a first phased array to receive radio signals. The first phased array is directional and controllably orientable within a first range of acute angles to a normal of the first face.
Implementation Method 2
The circuit includes a number of vias formed through the thickness of the planar substrate for transmission of signals between the circuit and the first antennae and/or between the circuit and the second antennae.
Data Source
AI summary
A wireless transceiver (1) includes a planar substrate (2) having first (3) and second (4) opposite faces and having a thickness between the first (2) and second (3) opposite faces. The wireless transceiver (1) also includes a number of first antennae (Rx1, . . . , RxN) supported on the first face (3). The wireless transceiver (1) also includes a number of second antennae (Tx1, . . . , TxM) supported on the second face (4). The wireless transceiver (1) also includes a circuit (7) supported by the planar substrate (2) and connected to the first antennae (Rx1, . . . , RxN) and the second antennae (Tx1, . . . , TxM). The circuit (7) includes a number of vias (8) formed through the thickness of the planar substrate (2) for transmission of signals between the circuit (7) and the first antennae (Rx1, . . . , RxN) and/or between the circuit (7) and the second antennae (Tx1, . . . , TxM). The circuit (7) is configured to control the first antennae (Rx1, . . . , RxN) as a first phased array (5) to receive radio signals (9). The first phased array (5) is directional and controllably orientable within a first range of acute angles (θR) to a normal (10) of the first face (3). The circuit (7) is also configured to control the second antennae (Tx1, . . . , TxM) as a second phased array (6) to retransmit (11) the radio signals received using the first phased array (5). The second phased array (6) is directional and controllably orientable within a second range of acute angles (θT) to a normal (12) of the second face (4).