Electronic Apparatus Dual-Fan Heat Diffusion for Thin Chassis Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic apparatuses face issues with localized high surface temperatures and reduced space efficiency due to the configuration of cooling modules, particularly with thinner chassis designs, where heat sinks occupy valuable installation space and concentrate heat, making it difficult to secure space for other components.
Innovation Solution
A cooling module design featuring a heat diffusion member between a pair of fans with discharge ports on side surfaces facing each other, coupled with an exhaust port positioned between the fans, allows for efficient heat diffusion and air discharge, reducing surface temperatures and improving space utilization within the chassis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat sinks are installed behind the fans, then cooling performance is improved, but the surface temperature of the chassis becomes locally high and space inside the chassis is reduced
Solution Approach 1:
The patent divides the cooling function into two separate components: a heat diffusion member that absorbs and diffuses heat from the heat generating element, and heat sinks that dissipate the diffused heat to the outside air. This segmentation allows heat to be spread across a larger area before dissipation, preventing localized high temperatures on the chassis surface while maintaining effective cooling performance
Solution Approach 2:
The heat diffusion member acts as an intermediary between the heat generating element and the heat sinks. It absorbs concentrated heat from the heat generating element and distributes it across its surface area, then transfers the diffused heat to the heat sinks for dissipation. This intermediary function prevents direct heat concentration at the heat sink location, thereby reducing localized chassis surface temperatures
2Reliability
If heat sinks are installed behind the fans, then cooling performance is improved, but installation space for other components is reduced
Solution Approach 1:
By segmenting the cooling system into a heat diffusion member and separate heat sinks, the patent enables more flexible spatial arrangement. The heat diffusion member can be positioned close to the heat generating element, while heat sinks can be placed in locations that optimize both cooling efficiency and available space for other components, thereby improving overall space utilization in the chassis
3Length of stationary object
If the chassis is made thinner, then portability is improved, but heat dissipation becomes less effective and surface temperature increases
Solution Approach 1:
The segmented cooling system allows the heat diffusion member to be positioned very close to the heat generating element, efficiently capturing heat before it can conduct to the chassis. The heat sinks can then be strategically placed to maximize dissipation efficiency within the thinner chassis profile, enabling effective heat management in thin, portable designs without sacrificing cooling performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses surface temperatures and enhances space efficiency, allowing for thinner chassis designs while maintaining cooling performance and providing additional space for components like batteries and antennas.
Implementation Method 1
a heat diffusion member that absorbs and diffuses heat from the heat generating element
Implementation Method 2
a pair of fans that are placed with the heat diffusion member located therebetween, and have discharge ports only in side surfaces facing each other, thereby making it possible to discharge air toward the heat diffusion member
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An object of the present disclosure is to provide an electronic apparatus capable of suppressing the surface temperature of a chassis and improving space efficiency inside the chassis. The electronic apparatus includes: a chassis; a heat generating element provided in the chassis; and a cooling module that is provided in the chassis and cools the heat generating element. The cooling module has: a heat diffusion member that absorbs and diffuses heat from the heat generating element; and a pair of fans that are placed with the heat diffusion member located therebetween, and have discharge ports provided only in side surfaces facing each other, thereby making it possible to discharge air toward the heat diffusion member. The chassis has an outer wall that extends along a placement direction of the pair of fans and has an exhaust port formed therein, and the exhaust port is positioned between the pair of fans in the case where the placement direction is taken as a reference.