Dual-Fan Cooling System for High-Pressure Airflow Heat Dissipation
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Solution Overview
Problem
In autonomous driving systems, vehicle-mounted computer servers face challenges in dissipating heat efficiently due to limited space, which can lead to component malfunction and instability.
Innovation Solution
A cooling system comprising a first set of fans creating high-pressure airflow, a first heat sink connected to heat-generating components, and a second heat sink cooled by the airflow, with optional configurations including heat pipes, turbofan heat sinks, and water cooling devices, to rapidly transfer and dissipate heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If heat generating components are arranged densely in a limited space, then the computing capability and processing efficiency are improved, but the heat dissipation becomes insufficient and components may malfunction
Solution Approach 1:
The cooling system is segmented into multiple functional modules: first heat sink directly connected to heat generating components, second heat sink positioned downstream, and multiple fan sets creating staged airflow paths. This segmentation allows efficient heat extraction at different locations along the airflow path, enabling effective cooling of densely packed high-power components.
Solution Approach 2:
The first heat sink acts as an intermediary between the heat generating components and the second heat sink, transferring heat from the components to the airflow. The high-pressure airflow serves as a mediator to transport thermal energy from the first heat sink to the second heat sink, where it is ultimately dissipated to the external environment.
2Temperature
If conventional cooling systems are used with standard airflow pressure, then the system structure is simple, but the heat dissipation speed is insufficient for high-power components
Solution Approach 1:
The cooling system employs dynamic high-pressure airflow generation using multiple fan sets that can be configured to create variable pressure gradients. This dynamic approach allows the system to adapt airflow pressure and velocity to match the thermal load of different component configurations, achieving rapid heat dissipation without requiring overly complex static structures.
Solution Approach 2:
The system utilizes pneumatic principles by employing fan sets to generate high-pressure airflow that forces rapid heat removal from the heat sinks. The pressurized air stream acts as a fluid medium to enhance convective heat transfer coefficients, significantly increasing heat dissipation speed compared to natural convection or low-pressure forced convection systems.
3Temperature
If heat generating components are placed close to the air outlet, then the cooling efficiency is improved, but the available space for component arrangement is reduced
Solution Approach 1:
The cooling system extends the heat dissipation process into the airflow direction dimension by positioning heat sinks at different locations along the airflow path. The first heat sink captures heat near the components while the second heat sink captures remaining heat downstream, effectively utilizing the length dimension of the case to maximize cooling efficiency without compromising component placement flexibility in other dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling system effectively increases heat dissipation speed, ensuring stable operation of heat-generating components by transferring heat quickly from the first heat sink to the second, where it is efficiently dissipated outside the case, enhancing the overall cooling effect.
Implementation Method 1
a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet
Implementation Method 2
a first heat sink connected to a heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink
Implementation Method 3
the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow
Data Source
AI summary
The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.