Dual-Fin Liquid Cooling Structure for Direct Chip Heat Transfer
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Solution Overview
Problem
Current liquid cooling devices face inefficiencies in heat dissipation due to multiple layers of substances between the cooling liquid and the chip, which reduce heat conduction efficiency.
Innovation Solution
A liquid cooling device with a dual fin module and heat dissipation shell that separates the cooling cavity into upper and lower spaces, allowing the cooling fluid to directly contact the chip, utilizing surface tension to form a liquid film for enhanced heat transfer, with upper and lower cooling fins to remove heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If multiple layers of substances are disposed between the cooling liquid and the chip, then the structural integrity and protection are improved, but the thermal resistance increases and heat conduction efficiency deteriorates
Solution Approach 1:
The patent removes the thermal interface material layer from the cooling system, allowing the cooling liquid to directly contact the chip surface. This extraction of the insulating layer eliminates the thermal resistance barrier while maintaining structural integrity through the cooling plate design with direct chip mounting capability.
Solution Approach 2:
The cooling plate features an asymmetric dual-fin structure with different fin configurations on opposite sides. The first cooling fins extend from a first side while the second cooling fins extend from a second side, creating asymmetric heat dissipation paths that optimize thermal management without requiring symmetric thermal interface materials.
2Reliability
If a dual fin module with isolation plate is used to separate cooling spaces, then the heat dissipation efficiency is improved, but the device complexity increases
Solution Approach 1:
The cooling plate is segmented into an upper cooling space and a lower cooling space by the isolation plate, allowing independent cooling circuits for different thermal zones. The first cooling fins are disposed in the upper cooling space while the second cooling fins are disposed in the lower cooling space, enabling differentiated heat dissipation strategies for different chip regions.
Solution Approach 2:
The isolation plate integrates multiple functions: it separates the upper and lower cooling spaces, provides mounting surfaces for the first cooling fins, and serves as a structural support element. This merging of functions reduces the need for additional separate components, thereby managing complexity while achieving efficient heat dissipation.
3Reliability
If the cooling liquid directly contacts the chip, then the heat transfer efficiency is improved, but the risk of liquid leakage and electrical short circuit increases
Solution Approach 1:
The cooling plate acts as an intermediary barrier between the cooling liquid and the chip. The cooling liquid flows through channels within the cooling plate and contacts the chip only at controlled interfaces, preventing uncontrolled leakage while maintaining efficient heat transfer. The isolation plate further mediates by creating separate cooling spaces with defined fluid pathways.
Solution Approach 2:
The cooling plate utilizes thin-walled structures with integrated cooling channels that provide sufficient mechanical strength to contain the cooling liquid while maintaining close thermal contact with the chip. The dual-fin module employs thin isolation plates that separate cooling spaces without creating significant thermal resistance, enabling direct liquid-to-chip heat transfer while preventing leakage through proper sealing design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency by allowing direct contact between the working fluid and the chip, generating a liquid film for efficient heat transfer, with the lower fins removing most heat and upper fins addressing residual heat, thereby reducing the working temperature and improving the efficiency of electronic products.
Implementation Method 1
the liquid cooling device utilizes a tiny distance between the cooling fins and the chip to generate a liquid film by the surface tension so as to transfer the heat generated by the chip to the cooling fins by the liquid film
Implementation Method 2
a cooling fluid entering into the cooling cavity and respectively flowing into the upper cooling space and the lower cooling space to cool a chip located in the lower cooling space
Data Source
AI summary
A liquid cooling device includes a heat dissipation shell and a dual fin module. The heat dissipation shell includes a cooling cavity, and the dual fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that a cooling fluid enters the cooling cavity and flows into the upper cooling space and the lower cooling space to cool a chip in the lower cooling space.