Dual-Flow Nozzle Switching for Uniform Substrate Treatment
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Solution Overview
Problem
High-temperature residual mixed liquid in treatment nozzles leads to bubble formation, non-uniform discharge pressure, and temperature inconsistencies, causing damage to substrate patterns and process uniformity during semiconductor processing.
Innovation Solution
A substrate treating apparatus with dual flow paths in the nozzle unit, allowing sequential discharge of different treatment liquids, where the first flow path is suctioned back after the first discharge, and the second flow path discharges the second treatment liquid, maintaining uniform temperature and preventing residual liquid contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple treatment liquids are supplied through a single nozzle with a mixing space, then the discharge structure is simple, but high-temperature residual mixed liquid remains in the mixing space causing bubbles and non-uniform discharge pressure
Solution Approach 1:
The single nozzle with mixing space is divided into multiple separate nozzles (first nozzle and second nozzle), each with independent flow paths. This segmentation eliminates the mixing space where high-temperature residual liquid accumulates, preventing bubble formation and discharge non-uniformity while maintaining relatively simple nozzle structures.
Solution Approach 2:
The mixing function is extracted from the nozzle structure itself. Instead of mixing treatment liquids inside the nozzle, the patent supplies multiple treatment liquids through separate flow paths without internal mixing, removing the source of residual liquid accumulation and discharge pressure non-uniformity.
2Productivity
If high-temperature treatment liquid is discharged through a single nozzle, then the discharge process is simple, but the high-temperature residual liquid damages substrate patterns and degrades process uniformity
Solution Approach 1:
The treatment liquid discharge is segmented into multiple independent streams through separate nozzles. Each nozzle discharges treatment liquid independently without accumulating high-temperature residual liquid, eliminating the harmful effect of thermal damage to substrate patterns while maintaining efficient discharge speed.
Solution Approach 2:
The system performs preliminary cooling or temperature management for treatment liquids before discharge by eliminating the mixing space where high-temperature liquid would accumulate. This prevents the formation of harmful high-temperature residual liquid before it can damage the substrate.
3Device complexity
If a single nozzle discharges mixed treatment liquids, then the liquid supply system is simple, but bubbles form in the high-temperature residual liquid causing non-uniform discharge
Solution Approach 1:
The liquid supply system is segmented into multiple independent flow paths, each supplying treatment liquid through separate nozzles. This eliminates the mixing space where bubbles would form in high-temperature residual liquid, ensuring uniform discharge while maintaining a relatively simple overall system structure.
Solution Approach 2:
The mixing function is extracted from the nozzle structure, eliminating the mixing space where bubbles form. Multiple treatment liquids are supplied through separate flow paths without internal mixing, removing the source of discharge non-uniformity caused by bubble formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves process uniformity and prevents substrate damage by ensuring consistent temperature and uniform liquid discharge, facilitating maintenance and management of the treatment liquid supply unit.
Implementation Method 1
sucking back the first flow path
Data Source
AI summary
Disclosed is a method of treating a substrate, the method including: a nozzle moving operation of moving a nozzle unit having a first flow path and a second flow path to a top of a substrate; a first discharge operation of, after the nozzle moving operation, discharging a first treatment liquid to the substrate through the first flow path; and a second discharge operation of, after the first discharge operation, stopping the discharge of the first treatment liquid to the substrate through the first flow path, sucking back the first flow path, and simultaneously discharging a second treatment liquid to the substrate through the second flow path.