Dual Fluid Supply Path for Supercritical Substrate Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional substrate processing apparatuses face contamination issues due to particle mixing during dry processing in supercritical or subcritical states, as the substrate processing fluid passes through a booster mechanism, leading to potential surface contamination and pattern collapse during semiconductor and flat panel display manufacturing.
Innovation Solution
A substrate processing apparatus with a dual fluid supply path system, where a constant pressure path and a boosted pressure path are used to supply substrate processing fluid to the processing chamber, with a control unit to switch between them, reducing the frequency of fluid passing through the booster mechanism and incorporating filters to remove foreign matter, ensuring the fluid is in a supercritical or subcritical state before reaching the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate processing fluid is supplied through the booster mechanism to increase pressure for supercritical state processing, then the processing effectiveness is improved, but particles are generated and mixed into the fluid causing substrate contamination
Solution Approach 1:
The fluid supply system is divided into multiple independent paths: a first fluid supply path that bypasses the booster mechanism for particle-free supply, and a second fluid supply path that goes through the booster mechanism for pressurized supply. This segmentation allows the system to select the appropriate path based on processing requirements, preventing particle contamination while maintaining processing effectiveness.
Solution Approach 2:
The system dynamically switches between the first and second fluid supply paths based on real-time processing conditions. The control unit monitors the processing state and automatically selects the appropriate fluid supply path, enabling the system to adapt to different processing stages and maintain optimal performance without contamination.
2Stability of the object's composition
If the substrate processing fluid always passes through the booster mechanism, then the fluid is consistently pressurized for supercritical state, but the frequency of particle mixing increases and contaminates the substrate surface
Solution Approach 1:
The fluid supply system is segmented into a first path (bypassing booster) and a second path (through booster), allowing selective pressurization. This enables the system to maintain fluid pressure consistency only when necessary for supercritical processing, while avoiding repeated particle contamination that would reduce substrate yield.
Solution Approach 2:
The system changes the pressure parameter dynamically by switching between supply paths. When supercritical processing is required, the second path provides consistent pressurization; when not required, the first path supplies fluid at lower pressure, avoiding unnecessary particle mixing and maintaining high substrate yield.
3Object-affected harmful factors
If a dual fluid supply path system is implemented to reduce particle mixing, then substrate contamination is reduced, but the device complexity increases
Solution Approach 1:
The fluid supply system is segmented into two paths with different characteristics. The first path provides a simple bypass route for particle-free supply, while the second path provides pressurized supply through the booster. This segmentation reduces particle contamination while keeping each individual path relatively simple, managing overall device complexity.
Solution Approach 2:
The dual fluid supply path system serves multiple functions: the first path provides particle-free supply for sensitive processing stages, while the second path provides pressurized supply for supercritical processing. This multi-functionality justifies the increased complexity by delivering diverse processing capabilities from a single integrated system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses particle mixing and contamination, improving the yield of the substrate processing apparatus by ensuring the substrate surface is not contaminated and preventing pattern collapse during dry processing.
Implementation Method 1
a phenomenon called a substrate surface pattern collapse occurs in which the pattern of the substrate surface collapses by the action of the surface tension of the processing liquid remaining on the substrate during the dry processing
Implementation Method 2
a filter that removes foreign matter within the substrate processing fluid
Implementation Method 3
the substrate is subjected to a dry processing that removes the processing liquids remaining on the substrate
Data Source
AI summary
The present disclosure provides a substrate processing apparatus including: a processing chamber configured to process a substrate; a fluid supply source configured to supply a substrate processing fluid used in processing for the substrate in a predetermined pressure; a constant pressure supplying path configured to supply the substrate processing fluid from the fluid supply source to the processing chamber in a predetermined pressure without boosting the pressure of the substrate processing liquid; a boosted pressure supplying path configured to boost the pressure of the substrate processing fluid from the fluid supply source into a predetermined pressure by a booster mechanism and supply the pressure boosted substrate processing fluid to the processing chamber; and a control unit configured to switch over the constant pressure supplying path and the boosted pressure supplying path.