PIC-Based Multichannel Transceiver With Dual Folding Mirror
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Solution Overview
Problem
Existing optical sensing technologies face challenges in achieving high resolution and throughput due to limitations in transmitter and receiver array pitches, which are constrained by the size of optical components, leading to inefficient scanning and array-based solutions.
Innovation Solution
The use of a dual folding mirror configuration with photonic integrated circuits (PICs) and a hierarchical network of optical switches, along with thermo-optic switches and beam displacement techniques, enhances scanning efficiency and resolution by interleaving beam paths and optimizing switching times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If scanning solutions are used to probe the area of interest densely, then resolution is improved, but throughput deteriorates due to low scanning speed
Solution Approach 1:
The system segments the optical beam into multiple parallel beams using beam splitting optics, allowing simultaneous probing of multiple points on the target. This transforms a single scanning beam into a multi-beam array, achieving dense spatial sampling without sequential scanning, thereby improving throughput while maintaining resolution.
Solution Approach 2:
The invention transitions from one-dimensional sequential scanning to two-dimensional parallel beam arrays by introducing spatial multiplexing. Multiple beams are arranged in arrays that can be steered across the target area, adding a spatial dimension to the probing approach and enabling simultaneous multi-point measurement.
2Productivity
If arrays of transmitters and receivers are used to improve throughput, then productivity is improved, but resolution deteriorates due to limited array pitches constrained by component sizes
Solution Approach 1:
The system replaces mechanical arrays of discrete transmitters and receivers with a single optical source and beam splitting optics. Instead of physically arranging multiple large optical components in dense arrays, the invention uses optical beam manipulation to create virtual arrays of probing points, overcoming the pitch limitations imposed by component sizes.
Solution Approach 2:
The invention creates multiple copies of the optical beam through beam splitting, generating an array of probe beams from a single source. These beam copies are spatially distributed and can be independently directed to different target locations, effectively creating a virtual transceiver array without the physical constraints of component pitch.
3Ease of manufacture
If larger optical components are used in transmitter and receiver arrays, then ease of manufacture is improved, but device area increases and array pitch is limited
Solution Approach 1:
The invention merges the functions of multiple transmitters and receivers into a single integrated optical system. By combining beam splitting, steering, and detection functions into one apparatus, the system achieves array-like functionality without requiring multiple discrete optical components, thereby reducing device area while maintaining manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-density scanning with improved throughput and resolution, allowing for detailed 3D mapping and efficient production of compact, low-cost transceiver arrays for optical sensing applications.
Implementation Method 1
a dual folding mirror mounted on the carrier substrate and including first and second reflecting surfaces disposed at opposite angles relative to a normal to the carrier substrate
Implementation Method 2
an optical distribution tree coupled to convey coherent radiation from a radiation source to the optical transceiver cells
Implementation Method 3
thermo-optic switches and beam displacement techniques, enhances scanning efficiency and resolution
Data Source
AI summary
An optoelectronic apparatus (100, 500) includes a dual folding mirror (114, 510) mounted on a carrier substrate (112, 524) with first and second reflecting surfaces (520, 522) disposed at opposite angles. A plurality of identical photonic integrated circuits (PICs 108, 110, 320, 502, 504, 506, 508) are disposed on the carrier substrate. Each PIC includes an array of optical transceiver cells (314, 400) on a planar substrate with respective edge couplers (406) along an edge of the planar substrate, and an optical distribution tree (320) coupled to convey coherent radiation to the optical transceiver cells. A first PIC is disposed on the carrier substrate such that the edge of the first PIC is in proximity to the first reflecting surface, and a second PIC is rotated by 180° relative to the first PIC such that the edge of the second PIC is in proximity to the second reflecting surface.