Hybrid Package Substrates for Dual-Footprint Decoupling Capacitors
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Solution Overview
Problem
Current semiconductor substrates are designed for specific decoupling capacitor footprints, limiting their use across different applications such as mobile and automotive industries, requiring separate substrates for each footprint, which complicates manufacturing and increases costs.
Innovation Solution
Development of hybrid substrates with dual sets of electrical contacts, allowing the same substrate to accommodate capacitors with different footprints, enabling use in both mobile and automotive markets by optimizing contact spacing and configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate substrates are designed for different capacitor footprints (mobile vs automotive), then each substrate can be optimized for its specific application, but manufacturing complexity increases and production costs rise
Solution Approach 1:
The substrate is designed with a universal contact pad layout that can accommodate both larger automotive capacitors and smaller mobile capacitors. The contact pads are arranged in configurations that support multiple capacitor footprint sizes, allowing a single substrate design to serve both automotive and mobile markets without requiring separate substrate designs for each application.
2Adaptability or versatility
If separate substrates are designed for different capacitor footprints, then each substrate can be optimized for its specific application, but production costs increase
Solution Approach 1:
The substrate is designed with a universal contact pad layout that can accommodate both larger automotive capacitors and smaller mobile capacitors. The contact pads are arranged in configurations that support multiple capacitor footprint sizes, allowing a single substrate design to serve both automotive and mobile markets without requiring separate substrate designs for each application.
3Device complexity
If a single substrate design is used for both mobile and automotive markets, then manufacturing complexity and costs are reduced, but the substrate must accommodate varying capacitor footprint requirements
Solution Approach 1:
The substrate incorporates contact pads with varying local characteristics - different pad sizes, shapes, and spacing arrangements in different regions of the substrate. This allows the same substrate to provide locally optimized contact configurations for both larger automotive capacitors and smaller mobile capacitors, accommodating different capacitor footprint requirements within a single universal design.
Data Source
AI summary
Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods are disclosed herein. In one embodiment, a substrate includes a first pair and a second pair of electrical contacts on a first surface of the substrate. The first pair of electrical contacts can be configured to receive a first surface-mount capacitor, and the second pair of electrical contacts can be configured to receive a second surface-mount capacitor. The first pair of electrical contacts can be spaced apart by a first space, and the second pair of electrical contacts can be spaced apart by a second space. The first and second spaces can correspond to corresponding to first and second distances between electrical contacts of the first and second surface-mount capacitors.