Dual-Frequency Antenna Packaging in Semiconductor Carriers
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Solution Overview
Problem
Existing semiconductor device packages face challenges in reducing size and achieving higher integration while supporting increased electronic functionality, particularly in portable devices.
Innovation Solution
A semiconductor device design that incorporates a carrier with antennas on opposite sides operating at different frequencies, utilizing a supporting element and shielding layer to optimize space without increasing size, and includes a method of manufacturing this structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antennas are integrated into a semiconductor device package, then electronic functionality is enhanced, but the size and form factor of the package increase
Solution Approach 1:
The patent places a first antenna and a second antenna in overlapping regions when viewed from different directions, with the first antenna at least partially under the connector and the second antenna at least partially under the first antenna. This nested arrangement allows multiple antennas to occupy the same spatial footprint, enhancing electronic functionality without increasing package size.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration by positioning antennas at different vertical levels (first antenna on carrier, second antenna under supporting element). This vertical stacking enables multiple antennas to coexist within the same lateral footprint, resolving the contradiction between functionality and size.
2Adaptability or versatility
If antennas operate at different frequencies, then communication versatility is improved, but electromagnetic interference between antennas increases
Solution Approach 1:
The patent introduces a supporting element and shielding layer as intermediary structures between the first antenna and second antenna. These intermediaries act as electromagnetic barriers that isolate the different frequency operations, allowing the antennas to operate simultaneously without interfering with each other, thus enabling communication versatility while preventing electromagnetic interference.
3Volume of moving object
If antennas are placed on opposite sides of the carrier, then space utilization is optimized, but manufacturing complexity increases
Solution Approach 1:
The patent divides the antenna system into separate segments (first antenna on one side of carrier, second antenna on opposite side under supporting element), allowing independent placement and integration of each antenna segment. This segmentation simplifies the manufacturing process by enabling modular assembly while achieving optimal space utilization through opposite-side placement.
Data Source
AI summary
The present disclosure provides a semiconductor device. The semiconductor device includes a carrier having a first side and a second side adjacent to the first side. The semiconductor device also includes a first antenna adjacent to the first side and configured to operate at a first frequency and a second antenna adjacent to the second side and configured to operate at a second frequency different from the first frequency. An method of manufacturing a semiconductor device is also provided.