Dual-Frequency Memory Module Interface for Scalable Bus Systems
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Solution Overview
Problem
Standardized memory modules optimized for low-end systems may be inefficient when used in larger systems, leading to potential losses in efficiency and increased costs due to the need for custom designs to meet different system requirements.
Innovation Solution
A memory module design with dual bus frequencies and a daisy-chained configuration using hub re-drive chips and buffered memory chips, allowing for efficient operation in both low-end and high-capacity configurations by reducing bus frequency and I/O ports, and supporting interleaved data storage across multiple chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If standardized memory modules optimized for low-end systems are used in larger systems, then manufacturing costs are reduced and ease of manufacture is improved, but system efficiency and performance deteriorate
Solution Approach 1:
The memory chip is designed with dual-frequency interface capability, allowing a single standardized module to function efficiently in both low-end systems (using first frequency) and high-end systems (using second frequency). This multi-functionality resolves the contradiction by enabling one design to serve multiple market segments without sacrificing performance in either.
Solution Approach 2:
The interface is designed to dynamically switch between operating at first frequency with full bus width or second frequency with reduced bus width based on system requirements. This dynamic adaptability allows the same hardware to optimize performance for different system capacities, maintaining efficiency across diverse applications while using standardized modules.
2Productivity
If custom memory chip designs are used to meet different system requirements, then system efficiency is maintained, but manufacturing costs increase and device complexity increases
Solution Approach 1:
A single memory chip design incorporates both first frequency and second frequency interface capabilities, eliminating the need for different custom designs for different system requirements. This universal design maintains system efficiency across applications while reducing device complexity and manufacturing costs compared to maintaining separate custom designs.
Solution Approach 2:
The interface parameters (frequency and bus width) are made configurable rather than fixed, allowing the same physical hardware to adapt to different system requirements. This parameter flexibility achieves the effect of custom designs without the actual complexity of multiple designs.
3Speed
If memory chips operate at high frequency with full bus width, then data transfer speed is improved, but power consumption increases
Solution Approach 1:
The memory chip interface dynamically adjusts operating frequency and bus width based on actual data transfer requirements. When full performance is needed, it operates at first frequency with full bus width; when lower performance suffices, it operates at second frequency with reduced bus width, thereby reducing power consumption while maintaining adequate speed.
Solution Approach 2:
The interface parameters including frequency and bus width are made variable rather than fixed, allowing optimization of the power-speed tradeoff. The system can select appropriate parameter combinations based on workload requirements, achieving energy efficiency without permanently sacrificing peak performance capability.
Data Source
AI summary
A design structure is provided for a memory module containing an interface for receiving memory access commands from an external source, in which a first portion of the interface receives memory access data at a first bus frequency and a second portion of the interface receives memory access data at a second different bus frequency. Preferably, the memory module contains a second interface for re-transmitting memory access data, also operating at dual frequency. The memory module is preferably used in a high-capacity memory subsystem organized in a tree configuration in which data accesses are interleaved. Preferably, the memory module has multiple-mode operation, one of which supports dual-speed buses for receiving and re-transmitting different parts of data access commands, and another of which supports conventional daisy-chaining.